XCVU5P-1FLVB2104E

The XCVU5P-1FLVB2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD. It delivers a high-capacity programmable logic fabric combined with significant on-chip memory and a large I/O complement in a ball-grid array package.

With 1,313,763 logic elements, approximately 191 Mbits of embedded memory, and 702 I/O, this device is intended for designs that require extensive programmable resources, high I/O density, and a compact FCBGA package with surface-mount mounting.

Key Features

• Core Logic Capacity  1,313,763 logic elements provide extensive programmable resources for complex logic implementation.
• Embedded Memory  Approximately 191 Mbits of on-chip RAM (190,976,000 bits) to support large buffering, state storage, and data processing tasks.
• I/O Density  702 I/O pins enable broad external connectivity for high-channel-count interfaces and parallel data paths.
• Power  Narrow supply voltage range of 825 mV to 876 mV for core operation.
• Package & Mounting  2104-FCBGA (2104-BBGA) package, supplier device package size 47.5×47.5 mm; surface-mount mounting for compact board integration.
• Operating Range & Grade  Operating temperature 0 °C to 100 °C; device is specified as Extended grade.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic capacity and embedded memory to implement wide datapaths, complex state machines, and parallel processing pipelines.
• Custom hardware acceleration  Leverage abundant logic elements and on-chip RAM to accelerate compute kernels and offload processing from general-purpose processors.
• High-channel I/O systems  The 702 I/O pins support multi-channel interfaces, high-speed data routing, and extensive sensor or peripheral connectivity.

Unique Advantages

• High logic density: 1,313,763 logic elements allow implementation of large, complex designs on a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 191 Mbits of on-chip RAM provide local storage for buffering, lookup tables, and state retention without external memory.
• Extensive I/O capability: 702 I/O pins enable flexible interfacing options and support for high parallelism in system designs.
• Compact FCBGA packaging: 2104-FCBGA (47.5×47.5 mm) package supports dense board layouts while maintaining high pin count.
• Controlled core power window: Core voltage specification of 825 mV to 876 mV defines precise power requirements for system power design and regulation.
• Extended operating range: Rated for 0 °C to 100 °C operation and designated Extended grade for a broad set of commercial applications.

Why Choose XCVU5P-1FLVB2104E?

The XCVU5P-1FLVB2104E positions itself as a high-capacity Virtex® UltraScale+™ FPGA offering a combination of extensive logic resources, substantial embedded memory, and a large I/O complement in a 2104-FCBGA surface-mount package. These characteristics make it well suited to designs that demand integration of complex digital functions and broad external interfacing while minimizing board-level components.

Offered by AMD and built around the UltraScale+ architecture, this device delivers a scalable platform for engineers seeking high-density programmable logic and on-chip memory in a compact package, helping to address demanding design requirements with a single programmable device.

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