XCVU5P-2FLVA2104I

The XCVU5P-2FLVA2104I is a Virtex® UltraScale+™ field programmable gate array from AMD, supplied in a 2104-FCBGA package. It provides a high count of logic elements and substantial on-chip memory, combined with a large I/O complement and an industrial operating temperature range for demanding embedded and system-level designs.

Key Features

• Core Logic — Approximately 1,313,763 logic elements for implementing large-scale digital designs and complex programmable logic.
• Embedded Memory — Approximately 191 Mbits of embedded memory to support data buffering, intermediate storage, and algorithmic state machines.
• I/O Capacity — 832 user I/O pins to support high-pin-count interfaces and multi-channel connectivity.
• Package — 2104-FCBGA (47.5 × 47.5 mm) package case in surface-mount format for dense board integration.
• Power — Core voltage supply range of 825 mV to 876 mV to match platform power design requirements.
• Temperature Range — Rated for operation from -40 °C to 100 °C, suitable for industrial temperature environments.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital systems — Implement large logic designs that require extensive programmable resources and on-chip memory.
• Memory-intensive algorithms — Use the embedded memory capacity to support buffering, lookup tables, and dataflow acceleration.
• High-pin-count interface modules — Leverage 832 I/O pins for designs with multiple parallel or serial interfaces and external peripherals.
• Industrial electronics — Deploy in systems that require operation across an industrial temperature range (-40 °C to 100 °C).

Unique Advantages

• Large logic capacity: Approximately 1.3 million logic elements provide headroom for feature-rich and complex designs.
• Significant embedded memory: Approximately 191 Mbits of on-chip RAM reduces dependence on external memory for many use cases.
• Extensive I/O: 832 I/O pins enable dense connectivity and flexible system partitioning.
• Industrial temperature capability: Rated from -40 °C to 100 °C to support deployment in harsh or wide-range temperature environments.
• Compact, surface-mount packaging: 2104-FCBGA (47.5 × 47.5 mm) package supports high-density board layouts and standardized assembly.
• RoHS compliant: Meets lead-free and restricted-substance requirements for many industrial supply chains.

Why Choose XCVU5P-2FLVA2104I?

The XCVU5P-2FLVA2104I balances very high logic capacity and substantial embedded memory with a large I/O count and industrial temperature rating, making it well suited to complex, memory- and I/O-intensive FPGA designs. Its package and supply-voltage characteristics support integration into robust surface-mount system designs.

This device is appropriate for engineering teams building scalable, long-lived systems that demand significant programmable logic, on-chip storage, and broad connectivity while operating across industrial temperature ranges. Its specifications provide a clear foundation for planning power, thermal, and board-level integration.

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