XCVU5P-2FLVC2104E

The XCVU5P-2FLVC2104E is a Virtex® UltraScale+™ field programmable gate array offering very large on-chip logic and memory capacity in a 2104-FCBGA package. It provides 1,313,763 logic elements, approximately 191 Mbits of embedded memory, and 416 user I/O pins to support complex, high-density programmable logic designs.

Designed for surface-mount board-level integration, this extended-grade device operates across a supply range of 825 mV to 876 mV and an operating temperature window of 0 °C to 100 °C.

Key Features

• Core Logic 1,313,763 logic elements provide large-capacity programmable logic for consolidating complex functions within a single FPGA device.
• Embedded Memory Approximately 191 Mbits of on-chip RAM bits to support substantial buffering, data storage, and on-chip processing requirements.
• High I/O Count 416 I/O pins enable extensive external interfacing and parallel connectivity for multi-channel designs.
• Package & Mounting 2104-BBGA (2104-FCBGA) package, supplier device package 2104-FCBGA (47.5 × 47.5 mm), optimized for surface-mount PCB assembly.
• Power Voltage supply range of 825 mV to 876 mV for core operation.
• Temperature & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Compliance RoHS-compliant for alignment with lead-free manufacturing requirements.

Typical Applications

• High-density programmable logic — Consolidating large-scale logic functions on a single FPGA using its 1,313,763 logic elements.
• Memory-intensive buffering and processing — Leveraging approximately 191 Mbits of embedded memory for on-chip data storage and streaming buffers.
• Parallel I/O and interface aggregation — Using 416 I/O pins to connect multiple external interfaces and parallel data channels.
• Board-level prototyping and system validation — Surface-mount 2104-FCBGA packaging supports integration into prototype and production PCBs requiring extended-grade components.

Unique Advantages

• High logic capacity: 1,313,763 logic elements provide the scale needed for complex, consolidated FPGA designs.
• Substantial on-chip memory: Approximately 191 Mbits of embedded RAM bits reduce dependence on external memory for many buffering and data-processing tasks.
• Extensive I/O: 416 I/O pins enable broad external connectivity and parallel interface support without additional multiplexing hardware.
• Robust package option: 2104-FCBGA (47.5 × 47.5 mm) offers a high-pin-count, surface-mount form factor for dense board layouts.
• Extended-grade operation: Specified operating range of 0 °C to 100 °C for applications requiring extended-grade devices.
• RoHS-compliant: Meets lead-free manufacturing requirements for compliant assembly processes.

Why Choose XCVU5P-2FLVC2104E?

The XCVU5P-2FLVC2104E positions itself as a high-capacity Virtex® UltraScale+™ FPGA that combines a very large logic element count, significant embedded memory, and wide I/O density in a single 2104-FCBGA surface-mount package. Its extended-grade temperature range and defined supply window make it suitable for demanding board-level designs that require consolidation of logic and memory on-chip.

This device is well suited for teams and systems targeting high-density programmable logic, substantial on-chip buffering, and extensive external interfacing while maintaining compliance with RoHS manufacturing requirements.

Request a quote or submit an inquiry to receive pricing, availability, and procurement details for the XCVU5P-2FLVC2104E.