XCVU5P-2FLVB2104I

The XCVU5P-2FLVB2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC offering a high logic and memory capacity in a 2104-FCBGA package. It is supplied in a 2104-BBGA/FCBGA package and is rated for industrial operating temperatures, making it suitable for designs that require substantial on-chip resources and robust operating range.

Key Features

• Logic Capacity  Approximately 1,313,763 logic elements provide large-scale programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 191 Mbits of on-chip RAM to support buffering, caching, and memory-intensive functions without external memory.
• I/O Density  702 I/O pins to support numerous external interfaces and parallel connections.
• Power Supply Range  Core supply specified from 0.825 V to 0.876 V for the device core domain.
• Package and Mounting  2104-FCBGA (47.5 × 47.5 mm) package in a surface-mount form factor for high-density board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to accommodate a wide range of environmental conditions.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density logic designs  Systems that require approximately 1.3 million logic elements to implement large custom logic networks and accelerators.
• Memory-intensive functions  Applications leveraging approximately 191 Mbits of embedded RAM for buffering, packet processing, or intermediate data storage.
• High I/O-count systems  Designs needing up to 702 I/O pins for multiple high-pin-count interfaces, parallel sensors, or multi-channel I/O.

Unique Advantages

• Substantial on-chip resources: Large logic element count and extensive embedded RAM reduce dependence on external components and simplify board design.
• High I/O capacity: 702 I/O pins enable broad connectivity options without additional multiplexing hardware.
• Industrial temperature suitability: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact, high-density package: 2104-FCBGA (47.5 × 47.5 mm) surface-mount package allows dense integration on modern PCBs.
• Controlled core supply range: Defined 0.825 V–0.876 V supply requirement aids power delivery design and consistency across deployments.
• RoHS compliant: Meets RoHS environmental requirements for lead-free assembly.

Why Choose XCVU5P-2FLVB2104I?

The XCVU5P-2FLVB2104I positions itself as a high-capacity FPGA option offering a combination of approximately 1.3 million logic elements, roughly 191 Mbits of embedded memory, and 702 I/O pins in a 2104-FCBGA surface-mount package. Its industrial temperature rating and defined core voltage range make it appropriate for designs that demand large on-chip resources and predictable electrical characteristics.

Choose this device when your design requires substantial programmable logic and memory integration in a compact BGA package while maintaining an extended temperature operating window and RoHS compliance.

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