XCVU5P-3FLVC2104E

The XCVU5P-3FLVC2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) by AMD, supplied in a 2104-FCBGA package (47.5 × 47.5 mm). It provides a high-capacity logic fabric combined with substantial on-chip memory and a large I/O count for complex digital designs.

This device is suited for designs that require substantial embedded memory, extensive I/O connectivity, and a broad operating temperature range, while conforming to RoHS environmental requirements.

Key Features

• Logic Capacity — Contains 1,313,763 logic elements to implement large-scale digital designs and complex logic functions.
• Embedded Memory — Approximately 191 Mbits of on-chip RAM to support buffering, look-up tables, and data storage without immediate reliance on external memory.
• I/O Integration — 416 user I/O pins for wide peripheral and interface connectivity.
• Supply Voltage — Core voltage specified between 873 mV and 927 mV, enabling defined power domain design.
• Package and Mounting — 2104-FCBGA (47.5 × 47.5 mm) BGA package; surface-mount device suitable for dense board layouts.
• Operating Range and Grade — Extended grade device with an operating temperature range of 0°C to 100°C.
• Environmental Compliance — RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• High-density digital processing — Large logic element count and embedded memory support complex algorithms and custom compute pipelines.
• Memory-intensive buffering and data handling — Approximately 191 Mbits of on-chip RAM provide local storage for packet buffering, frame buffering, or intermediate data staging.
• I/O-rich interface aggregation — 416 I/O pins enable aggregation and bridging of multiple external interfaces and peripherals.

Unique Advantages

• Significant on-chip resources: Over one million logic elements combined with substantial embedded memory reduce dependency on external components for many designs.
• High I/O count: 416 user I/Os allow flexible connectivity and system partitioning without extensive external multiplexing.
• Compact, manufacturable package: 2104-FCBGA (47.5 × 47.5 mm) surface-mount package supports dense PCB integration while keeping the device footprint defined.
• Defined supply and thermal envelope: Documented core voltage range of 873 mV–927 mV and operating temperature of 0°C–100°C enable predictable power and thermal planning.
• Extended-grade qualification: The device’s extended grade designation supports deployments requiring operation across the specified commercial-to-extended temperature range.
• Regulatory compliance: RoHS compliance simplifies integration into assemblies with environmental restrictions.

Why Choose XCVU5P-3FLVC2104E?

The XCVU5P-3FLVC2104E delivers a balance of large logic capacity, substantial embedded memory, and extensive I/O in a single 2104-FCBGA package. Its specifications make it appropriate for designs that require dense logic implementation, significant on-chip buffering, and broad peripheral connectivity while operating within the 0°C–100°C extended range.

As a Virtex® UltraScale+™ device from AMD, this FPGA is positioned for applications where integration of logic, memory, and I/O into a compact, RoHS-compliant package reduces external BOM and supports deterministic power and thermal planning.

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