XCVU7P-1FLVA2104I
| Part Description |
Virtex UltraScale+ FPGA, XCVU7P, 1,724,000 Logic Cells, 4560 DSP, FLVA2104, Commercial |
|---|---|
| Quantity | 1,410 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | FLVA2104 | Grade | N/A | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2104-BGA | Number of I/O | 832 | Voltage | 825 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 | Number of LABs/CLBs | 788160 | Number of Logic Elements/Cells | 1724000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.00.60 | ||
| Qualification | N/A | Total RAM Bits | 241801626 |
Overview of XCVU7P-1FLVA2104I – Virtex® UltraScale+™ Field Programmable Gate Array (FPGA), 2104-FCBGA (Industrial)
The XCVU7P-1FLVA2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 2104-FCBGA package designed for high-density, programmable logic applications. It combines large logic capacity, substantial on-chip memory, and a high I/O count to support complex digital designs requiring industrial-grade operating range and surface-mount packaging.
Key Features
- Logic Capacity Approximately 1,724,100 logic elements and 98,520 CLBs provide the raw fabric needed for large, multi-function designs.
- Embedded Memory Approximately 260.8 Mbits of on-chip RAM enable wide buffering, data staging, and memory-intensive functions without external RAM.
- I/O Density 832 user I/Os support extensive peripheral and high-bandwidth interface requirements.
- Power and Voltage Core supply range from 825 mV to 876 mV to match platform power architectures.
- Package and Mounting 2104-FCBGA (47.5 × 47.5 mm) package in a surface-mount footprint for compact board integration.
- Temperature and Grade Industrial grade device rated for operation from −40 °C to 100 °C.
- Environmental Compliance RoHS compliant for environmental and regulatory alignment.
Unique Advantages
- High logic density: The large count of logic elements supports complex algorithm implementation and multi-channel processing on a single device.
- Substantial on-chip memory: Approximately 260.8 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
- Extensive connectivity: 832 I/Os provide flexibility for dense peripheral, sensor, and interface integration without immediate expansion hardware.
- Industrial reliability: Rated for −40 °C to 100 °C operation and specified as industrial grade for demanding environments.
- Compact FCBGA packaging: The 2104-FCBGA (47.5 × 47.5 mm) surface-mount package enables high-density board layouts while maintaining thermal and mechanical robustness.
- Regulatory alignment: RoHS compliance supports eco-conscious manufacturing and supply-chain requirements.
Why Choose XCVU7P-1FLVA2104I?
The XCVU7P-1FLVA2104I positions itself as a high-capacity, industrial-grade FPGA solution that balances large logic resources, significant embedded memory, and broad I/O in a compact FCBGA package. It is suited to designs that require integrated programmable logic, on-chip storage, and extensive external interfacing while meeting industrial temperature and RoHS requirements.
For engineering teams and procurement focused on scalable, reliable programmable platforms, this device delivers the measurable resources needed to consolidate functionality and reduce system-level component count.
Request a quote or submit a parts inquiry for XCVU7P-1FLVA2104I to receive pricing and availability details. We will respond with the information required to evaluate this FPGA for your design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








