XCVU7P-1FLVA2104I

IC FPGA 832 I/O 2104FCBGA
Part Description

Virtex UltraScale+ FPGA, XCVU7P, 1,724,000 Logic Cells, 4560 DSP, FLVA2104, Commercial

Quantity 1,410 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device PackageFLVA2104GradeN/AOperating Temperature-40°C – 100°C
Package / Case2104-BGANumber of I/O832Voltage825 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceCompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4Number of LABs/CLBs788160Number of Logic Elements/Cells1724000
Number of GatesN/AECCNEAR99HTS Code8542.31.00.60
QualificationN/ATotal RAM Bits241801626

Overview of XCVU7P-1FLVA2104I – Virtex® UltraScale+™ Field Programmable Gate Array (FPGA), 2104-FCBGA (Industrial)

The XCVU7P-1FLVA2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 2104-FCBGA package designed for high-density, programmable logic applications. It combines large logic capacity, substantial on-chip memory, and a high I/O count to support complex digital designs requiring industrial-grade operating range and surface-mount packaging.

Key Features

  • Logic Capacity  Approximately 1,724,100 logic elements and 98,520 CLBs provide the raw fabric needed for large, multi-function designs.
  • Embedded Memory  Approximately 260.8 Mbits of on-chip RAM enable wide buffering, data staging, and memory-intensive functions without external RAM.
  • I/O Density  832 user I/Os support extensive peripheral and high-bandwidth interface requirements.
  • Power and Voltage  Core supply range from 825 mV to 876 mV to match platform power architectures.
  • Package and Mounting  2104-FCBGA (47.5 × 47.5 mm) package in a surface-mount footprint for compact board integration.
  • Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C.
  • Environmental Compliance  RoHS compliant for environmental and regulatory alignment.

Unique Advantages

  • High logic density: The large count of logic elements supports complex algorithm implementation and multi-channel processing on a single device.
  • Substantial on-chip memory: Approximately 260.8 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
  • Extensive connectivity: 832 I/Os provide flexibility for dense peripheral, sensor, and interface integration without immediate expansion hardware.
  • Industrial reliability: Rated for −40 °C to 100 °C operation and specified as industrial grade for demanding environments.
  • Compact FCBGA packaging: The 2104-FCBGA (47.5 × 47.5 mm) surface-mount package enables high-density board layouts while maintaining thermal and mechanical robustness.
  • Regulatory alignment: RoHS compliance supports eco-conscious manufacturing and supply-chain requirements.

Why Choose XCVU7P-1FLVA2104I?

The XCVU7P-1FLVA2104I positions itself as a high-capacity, industrial-grade FPGA solution that balances large logic resources, significant embedded memory, and broad I/O in a compact FCBGA package. It is suited to designs that require integrated programmable logic, on-chip storage, and extensive external interfacing while meeting industrial temperature and RoHS requirements.

For engineering teams and procurement focused on scalable, reliable programmable platforms, this device delivers the measurable resources needed to consolidate functionality and reduce system-level component count.

Request a quote or submit a parts inquiry for XCVU7P-1FLVA2104I to receive pricing and availability details. We will respond with the information required to evaluate this FPGA for your design.

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