XCVU7P-1FLVB2104E

The XCVU7P-1FLVB2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It provides a high-capacity programmable logic fabric combined with substantial embedded memory and a large I/O complement in a high-pin-count FCBGA package.

With 1,724,100 logic elements, approximately 261 Mbits of on-chip RAM and 702 I/O, this device is intended for designs that require significant logic density, embedded memory, and extensive external connectivity while operating within an extended temperature grade.

Key Features

• Programmable logic — Approximately 1,724,100 logic elements to implement large, complex digital designs.
• Embedded memory — Approximately 261 Mbits of on-chip RAM (260,812,800 total RAM bits) for buffering, state storage, and data path requirements.
• I/O capacity — 702 I/O pins to support broad external connectivity and interface variety.
• Power supply — Core voltage supply range of 825 mV to 876 mV for device operation.
• Package and mounting — 2104-BBGA, FCBGA package; supplier device package 2104-FCBGA (47.5 × 47.5 mm), surface-mount mounting type for high pin count applications.
• Operating conditions and grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Regulatory status — RoHS compliant.

Typical Applications

• High-density digital systems — Leverage the device’s ~1.72M logic elements and substantial embedded memory to implement complex, large-scale logic functions and state machines.
• Interfaces and I/O-rich designs — Use the 702 I/O pins to connect multiple external devices, buses, and high-pin-count subsystems.
• On-chip memory-centric implementations — Employ approximately 261 Mbits of embedded RAM for buffering, packet storage, and intermediate data processing without relying exclusively on external memory.
• Compact, high-pin-count board designs — The 2104-FCBGA (47.5 × 47.5 mm) surface-mount package provides a dense form factor for systems that require many connections in a single FPGA footprint.

Unique Advantages

• Large programmable capacity: Provides approximately 1,724,100 logic elements to support extensive custom logic integration on a single device.
• Substantial embedded memory: Approximately 261 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O count: 702 I/O pins enable wide-ranging connectivity and flexible system partitioning.
• High-pin-count surface-mount package: The 2104-FCBGA (47.5 × 47.5 mm) package supports dense routing and high signal count in a compact footprint.
• Defined operating envelope: Extended grade and 0 °C to 100 °C operating range provide clear environmental limits for system design and thermal planning.
• RoHS compliant: Meets RoHS requirements for materials compliance.

Why Choose XCVU7P-1FLVB2104E?

The XCVU7P-1FLVB2104E delivers substantial on-chip resources—over 1.7 million logic elements, roughly 261 Mbits of embedded RAM, and 702 I/O—in a high-pin-count FCBGA package. Its defined core voltage range and extended temperature grade provide clear electrical and environmental parameters for integration into demanding digital systems.

This device is suited to designs that require large programmable fabric, significant internal memory, and extensive external connectivity within a single FPGA footprint, offering a scalable hardware building block for complex system implementations backed by the Virtex® UltraScale+™ family.

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