XCVU7P-2FLVB2104E

The XCVU7P-2FLVB2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 2104-FCBGA package (47.5 × 47.5 mm) and specified for extended-grade operation. It combines extensive programmable logic, abundant embedded memory, and a high I/O count to address complex digital designs that require substantial on-chip resources.

Key Features

• Programmable Logic Capacity  Approximately 1,724,100 logic elements provide large-scale programmable logic resources for complex designs.
• Embedded Memory  Approximately 260.8 Mbits of on-chip RAM offer substantial local storage for buffers, state, and data processing.
• I/O Density  702 user I/O pins enable broad connectivity to external peripherals, sensors, and subsystems.
• Package and Mounting  Supplied in a 2104-FCBGA (47.5 × 47.5 mm) package and intended for surface-mount assembly for system-level integration.
• Power Supply Range  Core voltage specified between 825 mV and 876 mV, defining the device supply window for power planning.
• Operating Range and Grade  Rated for operation from 0 °C to 100 °C and designated as Extended grade.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Compute-Intensive Logic  Implement large, complex finite-state machines, datapaths, and custom compute blocks using the device’s extensive logic element count.
• On-Chip Buffering and Memory-Heavy Designs  Use the approximately 260.8 Mbits of embedded memory for frame buffers, packet buffering, or other memory-intensive functions without relying solely on external RAM.
• High-Connectivity Systems  Leverage 702 user I/O for multi-channel interfacing, sensor aggregation, or dense peripheral connectivity in system designs.
• Prototyping and System Integration  The large logic and memory resources make this device suitable for prototyping and consolidating functions traditionally spread across multiple components.

Unique Advantages

• Extensive On-Chip Programmability: Roughly 1.7 million logic elements enable consolidation of complex functions into a single device, simplifying board-level design.
• Large Embedded Memory Capacity: Approximately 260.8 Mbits of RAM provides substantial on-chip storage for low-latency buffering and state retention.
• Broad I/O Count: 702 user I/O pins facilitate versatile system interfacing and reduce the need for external I/O expanders.
• Robust Package for System Assembly: The 2104-FCBGA footprint (47.5 × 47.5 mm) supports surface-mount integration in dense PCB layouts.
• Extended Operating Range and Compliance: Extended-grade specification (0 °C to 100 °C) and RoHS compliance support reliable deployment within the stated temperature window and environmental standards.
• Manufactured by AMD: Sourced from AMD, providing a known manufacturing origin for procurement and lifecycle considerations.

Why Choose XCVU7P-2FLVB2104E?

The XCVU7P-2FLVB2104E positions itself as a high-capacity programmable logic device that combines a very large logic-element count with substantial embedded memory and extensive I/O. These measurable on-chip resources make it suitable for designs that require consolidation of complex functions, significant local buffering, and broad peripheral connectivity within a single FPGA package.

Specified for extended-grade operation and supplied in a 2104-FCBGA surface-mount package, this AMD FPGA is a practical option for projects that need high integration density and predictable electrical and thermal parameters during system design and procurement.

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