XCVU7P-2FLVC2104E

The XCVU7P-2FLVC2104E is a Virtex® UltraScale+™ FPGA IC from AMD offering very high logic density and large on-chip memory in a 2104-BBGA FCBGA package. This extended-grade, surface-mount device provides a fixed supply voltage window and a broad I/O count to support complex programmable logic designs.

Key on-chip resources include 1,724,100 logic elements, approximately 260.8 Mbits of embedded memory, and up to 416 I/O pins—delivering the raw capacity needed for demanding FPGA-based systems while meeting RoHS compliance.

Key Features

• Core Logic  Contains 1,724,100 logic elements for high-density programmable logic implementations.
• Embedded Memory  Approximately 260.8 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive functions.
• I/O  Up to 416 general-purpose I/O pins to accommodate complex interfacing and parallel connectivity requirements.
• Power Supply  Designed to operate within a supply voltage range of 825 mV to 876 mV for the core supply domain.
• Package and Mounting  2104-BBGA FCBGA package (supplier device package: 2104-FCBGA, 47.5 × 47.5 mm) for surface-mount PCB assembly.
• Operating Grade and Temperature  Extended grade device specified for operation from 0 °C to 100 °C.
• Environmental  RoHS compliant.

Typical Applications

• Custom FPGA-based systems  For designs that require roughly 1,724,100 logic elements and substantial embedded memory to implement complex programmable functions.
• High-density signal processing  Suitable where approximately 260.8 Mbits of on-chip RAM and extensive parallel I/O (416 pins) are needed for buffering and data movement.
• Multi-interface platforms  Well suited to boards requiring large I/O counts and a compact 2104-FCBGA footprint (47.5 × 47.5 mm) for surface-mount integration.

Unique Advantages

• High logic capacity: 1,724,100 logic elements enable dense implementation of complex algorithms and large-scale designs.
• Substantial embedded memory: Approximately 260.8 Mbits of on-chip RAM reduces external memory dependence for many workloads.
• Large I/O availability: 416 I/O pins allow flexible interfacing with multiple peripherals and parallel buses.
• Compact package: 2104-FCBGA (47.5 × 47.5 mm) provides high integration density in a surface-mount form factor.
• Extended operating range: Specified for 0 °C to 100 °C operation, aligning with extended-grade application requirements.
• Regulatory compliance: RoHS-compliant manufacturing supports environmental and regulatory considerations.

Why Choose XCVU7P-2FLVC2104E?

The XCVU7P-2FLVC2104E delivers a combination of very high logic density, large embedded memory, and extensive I/O in a single extended-grade FPGA package. Its specified core voltage range, surface-mount 2104-FCBGA package, and RoHS compliance make it a practical choice for engineers specifying high-capacity programmable logic for complex systems.

This part is appropriate for teams and projects that require scalable on-chip resources and a compact, high-pin-count implementation. The combination of resources and package characteristics provides a clear roadmap for designs that prioritize integration, on-chip memory capacity, and significant I/O connectivity.

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