XCVU7P-3FLVA2104E

The XCVU7P-3FLVA2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD designed for high-capacity programmable logic applications. It provides 1,724,100 logic elements and approximately 260.8 Mbits of embedded memory, together with 832 user I/O pins in a 2104-FCBGA package.

This surface-mount, extended-grade device is specified for operation from 0 °C to 100 °C and supports a supply voltage range of 873 mV to 927 mV, offering a compact, high-density option for systems that require large logic and memory resources on a single chip.

Key Features

• Core Logic Capacity — 1,724,100 logic elements to support complex programmable logic and large-scale integration on a single FPGA device.
• Embedded Memory — Approximately 260.8 Mbits of on-chip RAM for buffering, frame storage, and other memory-intensive functions.
• High I/O Count — 832 user I/O pins to interface with multiple high-speed peripherals, boards, and subsystem interfaces.
• Package and Mounting — 2104-FCBGA package (47.5 × 47.5 mm) optimized for surface-mount PCB assembly, enabling dense board-level integration.
• Power Supply Range — Specified supply voltage window of 873 mV to 927 mV to match system power-rail requirements.
• Temperature and Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C for applications within that thermal envelope.
• Regulatory Status — RoHS compliant for materials and manufacturing practices.

Typical Applications

• High-density programmable logic designs — Use the large logic element count and embedded memory to implement complex custom logic, parallel datapaths, and large state machines.
• I/O-rich interface aggregation — 832 I/O pins support aggregation of multiple interfaces and board-level connectivity in a single FPGA footprint.
• Compact, board-mounted FPGA solutions — The 2104-FCBGA (47.5 × 47.5 mm) surface-mount package enables integration into space-constrained PCBs while maintaining high device capability.

Unique Advantages

• High logic density: 1,724,100 logic elements reduce the need for multiple devices by consolidating large designs into one FPGA.
• Substantial on-chip memory: Approximately 260.8 Mbits of embedded RAM supports buffering and local data storage without external memory in many use cases.
• Extensive I/O capacity: 832 user I/O pins provide flexibility to connect numerous peripherals and interconnects directly to the FPGA.
• Compact FCBGA package: 2104-FCBGA (47.5 × 47.5 mm) offers a dense package option for surface-mount assembly and board-space optimization.
• Extended-grade operation: Rated for 0 °C to 100 °C operation to meet thermal requirements within that range.
• RoHS compliant: Meets common materials and environmental requirements for modern electronics manufacturing.

Why Choose XCVU7P-3FLVA2104E?

The XCVU7P-3FLVA2104E positions itself as a high-capacity programmable logic device designed for applications that demand substantial on-chip logic, memory, and I/O in a single surface-mount package. Its combination of 1,724,100 logic elements, approximately 260.8 Mbits of embedded RAM, and 832 I/O make it suitable for consolidating complex designs and reducing board-level component count.

For system designers seeking a compact, extended-grade FPGA solution with a defined supply voltage window and a high pin-count FCBGA footprint, this AMD Virtex® UltraScale+™ device delivers a balance of integration and capability that supports scalable designs within the specified thermal and electrical limits.

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