XCVU7P-3FLVB2104E

The XCVU7P-3FLVB2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 2104-FCBGA package. This extended-grade, surface-mount device delivers a large logic fabric and substantial on-chip memory for demanding programmable logic designs.

Key device attributes include 1,724,100 logic elements, approximately 260.8 Mbits of embedded memory, 702 I/O pins, and an operating voltage window of 873 mV to 927 mV, with an operating temperature range of 0 °C to 100 °C.

Key Features

• Logic Capacity  1,724,100 logic elements with 98,520 CLBs to support complex programmable logic and high-density implementation.
• Embedded Memory  Approximately 260.8 Mbits of on-chip RAM for buffering, large LUT-based storage, and data-path implementation.
• I/O Density  702 I/O pins to accommodate extensive external interfacing and high-pin-count system designs.
• Power Supply  Specified core voltage range of 873 mV to 927 mV for device operation.
• Package and Mounting  2104-FCBGA package (47.5 × 47.5 mm) in a surface-mount BGA format for high-density board integration.
• Temperature and Grade  Extended-grade device rated for operation from 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High logic density: The device’s 1,724,100 logic elements enable implementation of large, complex designs without external programmable logic expansion.
• Significant embedded memory: Approximately 260.8 Mbits of on-chip RAM reduce dependence on external memory for many buffering and data-path functions.
• Extensive I/O count: 702 I/Os provide flexibility for multi-channel interfaces and high-pin-count system connections.
• Compact, high-density package: 2104-FCBGA (47.5×47.5 mm) allows integration into space-constrained PCBs while supporting large die capacity.
• Extended-grade operation: Rated for 0 °C to 100 °C to match designs requiring broader commercial temperature range.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCVU7P-3FLVB2104E?

The XCVU7P-3FLVB2104E positions itself as a high-capacity, highly integrated FPGA option for designs that require substantial logic resources, on-chip memory, and a large number of I/Os in a single surface-mount package. Its extended-grade rating and defined supply and temperature ranges provide clear, verifiable operating parameters for procurement and system design.

This device is well suited to engineering teams seeking a scalable, high-density programmable platform with verified electrical and thermal limits, enabling long-term design stability and predictable integration into complex electronic systems.

Request a quote or submit a pricing inquiry for the XCVU7P-3FLVB2104E to begin the procurement process and confirm availability and lead times.