XCVU7P-L2FLVA2104E

The XCVU7P-L2FLVA2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC delivering very high logic density, on-chip memory and a large I/O complement in a surface-mount FCBGA package. Its specifications—1,724,100 logic elements, approximately 261 Mbits of embedded memory and 832 I/O—make it suitable for designs that require dense logic integration and substantial local RAM.

Packaged in a 2104-FCBGA (2104-BBGA) footprint and offered in extended-grade operation, this device targets systems needing robust on-board resources and a compact board-level implementation while operating across a 698 mV to 742 mV supply range and a 0 °C to 110 °C temperature window.

Key Features

• High Logic Density  Provides 1,724,100 logic elements to support complex digital designs and large-scale programmable logic implementations.
• On-chip Memory  Approximately 261 Mbits of embedded memory for local buffering, data staging and memory-intensive processing.
• Large I/O Count  832 general-purpose I/O pins to accommodate wide parallel interfaces, multiple high-pin-count peripherals or extensive board-level connectivity.
• Package and Mounting  Delivered in a 2104-FCBGA (2104-BBGA) surface-mount package with a 47.5 × 47.5 footprint, enabling compact board integration.
• Power Range  Operates from a supply range of 698 mV to 742 mV, enabling designs that target this specific core-voltage window.
• Extended Temperature Grade  Rated for operation from 0 °C to 110 °C, suitable for systems requiring extended thermal tolerance.
• Compliance  RoHS compliant for reduced-hazard material conformity.

Typical Applications

• High-density digital processing  Large-scale logic element count and substantial embedded memory support dense FPGA-based processing and algorithm implementation.
• Multi-channel I/O systems  With 832 I/O, the device is suitable for designs requiring broad parallel connectivity or multiple simultaneous interfaces.
• Compact board-level integration  The 2104-FCBGA surface-mount package enables compact placement of a high-capacity FPGA on space-constrained PCBs.

Unique Advantages

• Highly integrated resources: Combination of over 1.7 million logic elements and approximately 261 Mbits of on-chip RAM reduces dependence on external memory and simplifies board-level architectures.
• Extensive I/O capability: 832 I/O pins allow direct interfacing to many peripherals and wide buses without excessive multiplexing.
• Board-level form factor: 2104-FCBGA package (47.5 × 47.5) provides a dense package option for compact system designs.
• Extended operating range: Rated for 0 °C to 110 °C, delivering broader thermal headroom for demanding environments.
• Regulatory compliance: RoHS compliance supports material-conformant designs and simplifies regulatory planning.

Why Choose XCVU7P-L2FLVA2104E?

The XCVU7P-L2FLVA2104E combines very high logic capacity, substantial embedded memory and a large I/O complement in an extended-grade, surface-mount FCBGA package. It is positioned for designs that require concentrated programmable resources and compact board integration while operating within a defined core-voltage and temperature window.

This device is appropriate for engineering teams building solutions that demand dense logic fabrics, significant on-chip RAM and wide connectivity, offering a balanced platform for scalable, robust FPGA-based implementations.

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