XCVU9P-1FLGA2104E

The XCVU9P-1FLGA2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) by AMD, supplied in a 2104-FCBGA (47.5 × 47.5 mm) package. It provides very high logic capacity and substantial on-chip memory for designs that require large programmable fabric and extensive I/O connectivity.

With millions of logic elements, hundreds of Mbits of embedded RAM and a wide I/O count, this surface-mount FPGA is aimed at applications demanding dense integration and scalable programmable resources while operating within an extended grade temperature range.

Key Features

• Core Logic Capacity  Approximately 2,586,150 logic elements, delivering large programmable fabric for complex logic and custom processing functions.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM to support buffering, large datasets, and memory-intensive algorithms directly on the FPGA fabric.
• I/O Count  832 available I/O pins to support high-channel-count interfaces and extensive connectivity without external multiplexing.
• Package & Mounting  2104-FCBGA (47.5 × 47.5 mm) package case (2104-BBGA, FCBGA) with surface-mount configuration for compact, production-ready board designs.
• Power Supply Range  Core voltage supply range of 825 mV to 876 mV to match system power delivery requirements.
• Temperature Grade  Extended grade with an operating range of 0 °C to 100 °C for deployment in demanding commercial environments.
• Environmental Compliance  RoHS compliant, meeting common environmental and lead-free manufacturing requirements.

Typical Applications

• High-density signal processing  Leverage the large logic element count and on-chip memory for DSP pipelines, video processing, and real-time data transformation.
• Network & communications  Use the high I/O count and programmable fabric to implement protocol processing, packet handling, and interface bridging.
• Compute acceleration  Implement custom accelerators or offload engines that require substantial logic and embedded RAM for fast local data access.
• System prototyping and integration  Ideal for complex prototypes and production systems that need dense integration of logic, memory, and I/O in a single FPGA package.

Unique Advantages

• High logic density: The device’s approximately 2.59 million logic elements enable large-scale, complex implementations without multiple devices.
• Substantial on-chip memory: Around 391 Mbits of embedded RAM reduce reliance on external memory for many buffering and storage needs, simplifying board design.
• Extensive I/O capability: 832 I/Os support multiple high-channel interfaces and flexible board-level connectivity options.
• Compact FCBGA package: The 2104-FCBGA (47.5 × 47.5 mm) package provides a high-pin-count solution in a single surface-mount component for space-efficient layouts.
• Extended operating range: Rated for 0 °C to 100 °C operation to suit a wide range of commercial and industrial use cases.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing and environmental sourcing requirements.

Why Choose XCVU9P-1FLGA2104E?

The XCVU9P-1FLGA2104E combines very large programmable logic capacity, substantial embedded memory, and a high I/O count in a single AMD Virtex® UltraScale+™ FPGA package. Its surface-mount 2104-FCBGA form factor and extended temperature grade make it well suited for complex commercial and industrial electronic systems that require dense integration of logic, memory, and interfaces.

This device is a fit for engineers and teams building high-performance, scalable FPGA-based designs that need on-chip resources to reduce external components and streamline board-level integration. Its specification set supports long-term design planning where logic capacity, embedded RAM and I/O density are primary selection criteria.

Request a quote or submit an inquiry to receive pricing and availability for the XCVU9P-1FLGA2104E. Our team can provide technical and procurement assistance tailored to your project requirements.