XCVU9P-1FLGB2104E

The XCVU9P-1FLGB2104E is a Virtex® UltraScale+™ FPGA from AMD, supplied in a 2104-FCBGA package. It provides a large programmable fabric with 2,586,150 logic elements, approximately 391 Mbits of embedded memory, and up to 702 I/O pins for complex digital designs.

This device is offered in an extended grade with an operating temperature range of 0 °C to 100 °C and a core voltage supply range of 825 mV to 876 mV, packaged for surface-mount board integration.

Key Features

• Core Logic 2,586,150 logic elements for implementing extensive programmable logic and complex digital functions.
• Embedded Memory Approximately 391 Mbits of on-chip RAM to support large buffering, data storage and memory-intensive logic.
• I/O Density 702 I/O pins to enable extensive external interfacing and connectivity options.
• Power Supply Core voltage supply specified from 825 mV to 876 mV to match system power design requirements.
• Package 2104-FCBGA (47.5×47.5) supplier device package with 2104-BBGA package case, suited for high-pin-count surface-mount assemblies.
• Mounting & Grade Surface mount device offered in an extended grade.
• Operating Temperature Rated for 0 °C to 100 °C operation to meet extended temperature application needs.
• Environmental Compliance RoHS compliant to support regulatory and environmental requirements.

Unique Advantages

• Large programmable capacity: 2,586,150 logic elements enable consolidation of complex functions into a single FPGA device.
• Substantial on-chip memory: Approximately 391 Mbits of embedded RAM reduces the need for external memory in many designs.
• High I/O count: 702 I/O pins provide wide connectivity for multi-channel interfaces and dense board-level integration.
• Compact, high-density package: 2104-FCBGA (47.5×47.5) package case supports high-pin-count layouts in a surface-mount form factor.
• Extended temperature grade: 0 °C to 100 °C operating range addresses applications requiring elevated ambient operation.
• Regulatory readiness: RoHS compliance simplifies environmental qualification and procurement.

Why Choose XCVU9P-1FLGB2104E?

The XCVU9P-1FLGB2104E combines a high logic element count, substantial embedded memory, and a large I/O complement in the Virtex® UltraScale+™ family by AMD. Its extended-grade temperature rating, specified core voltage range, and FCBGA packaging make it suitable for designs that require significant on-chip resources and dense external connectivity.

This device is aimed at projects where consolidation of functionality onto a single FPGA, memory capacity on-chip, and high pin count are priorities. Selecting this part supports scalability within the UltraScale+ series and leverages AMD’s platform for robust, long-term design planning.

Request a quote or submit your procurement requirements to receive pricing and availability information for the XCVU9P-1FLGB2104E.