XCVU9P-1FLGA2577I

The XCVU9P-1FLGA2577I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC providing large on-chip logic and embedded memory capacity in a 2577-FCBGA package. Its specification set — including millions of logic elements, hundreds of megabits of RAM, and 448 I/O — targets designs that require significant programmable logic, dense memory resources, and a high I/O count.

Key Features

• FPGA Architecture  Virtex® UltraScale+™ field programmable gate array offering a programmable hardware platform for custom logic implementations.
• Logic Capacity  Approximately 2,586,150 logic elements to support large-scale logic integration and complex implementation mapping.
• Embedded Memory  Approximately 391 Mbits of embedded memory (total RAM bits: 391,168,000) for on-chip data buffering, state storage, and memory-intensive functions.
• I/O Count  448 I/O pins provide extensive external connectivity for high-bandwidth interfaces and multiple peripheral connections.
• Power Supply  Specified core voltage supply range of 825 mV to 876 mV, enabling designs that must meet defined supply constraints.
• Package & Mounting  2577-FCBGA package (2577-BBGA, FCBGA; supplier device package 52.5×52.5), surface-mount device suitable for board-level assembly.
• Temperature & Grade  Industrial-grade device rated for operation from −40°C to 100°C to support deployments across a wide ambient range.
• Compliance  RoHS compliant, meeting standard environmental requirements for restricted substances.

Typical Applications

• Custom hardware acceleration  Use the large logic element count and embedded memory to implement hardware accelerators and offload compute-intensive kernels.
• Prototyping and system validation  Leverage the programmable fabric and high I/O density to prototype complex digital subsystems and validate interface behaviors.
• High-density digital processing  Deploy substantial on-chip RAM and logic resources for data-path processing, buffering, and parallel operations.

Unique Advantages

• Extensive programmable logic:  Around 2.59 million logic elements enable consolidation of large, complex designs into a single device, reducing board-level integration complexity.
• Significant on-chip memory:  Approximately 391 Mbits of embedded RAM supports sizeable buffering and local data storage, minimizing external memory dependence.
• High I/O capability:  448 I/O pins provide flexibility for multiple interfaces and parallel data channels, simplifying system-level routing choices.
• Industrial temperature range:  Rated from −40°C to 100°C for suitability in environments that require extended operating temperature coverage.
• Compact FCBGA package:  2577-FCBGA (52.5×52.5) surface-mount package packs large capability into a standardized footprint for system assembly.
• Regulatory readiness:  RoHS compliance supports designs constrained by restricted substance requirements.

Why Choose XCVU9P-1FLGA2577I?

The XCVU9P-1FLGA2577I combines a large programmable fabric with substantial embedded memory and a high I/O count in an industrial-grade FCBGA package. This configuration is well suited to designers who need to integrate extensive digital logic, local memory, and multiple interfaces on a single device.

Choosing this FPGA supports designs that prioritize integration density, predictable supply and thermal ranges, and compliance with environmental restrictions, delivering a scalable platform for complex hardware implementations.

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