XCVU9P-2FLGA2104E

The XCVU9P-2FLGA2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) optimized for high-density programmable logic. It delivers 2,586,150 logic elements, approximately 391 Mbits of embedded memory, and 832 user I/O in a 2104-FCBGA package.

Designed for applications that require large logic capacity, extensive on-chip RAM, and high I/O counts, this surface-mount, extended-grade device operates from 0 °C to 100 °C with a core supply range of 825 mV to 876 mV and is RoHS compliant.

Key Features

• Core Logic 2,586,150 logic elements provide substantial programmable fabric for implementing large-scale digital logic and custom compute pipelines.
• Embedded Memory Approximately 391 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory dependency.
• I/O Capacity 832 user I/O pins to support broad interfacing needs and high pin-count system integration.
• Package & Mounting Available in a 2104-FCBGA (47.5 × 47.5 mm) package, supplied as a surface-mount device suitable for high-density board designs.
• Power Core voltage supply range of 825 mV to 876 mV to match system power-rail designs requiring controlled core levels.
• Temperature & Grade Extended grade device specified for an operating temperature range of 0 °C to 100 °C.
• Compliance RoHS compliant for regulatory and environmental requirements.

Typical Applications

• High-density data processing — Use the large logic element count and substantial embedded memory to implement complex data-paths and parallel processing engines.
• Interface aggregation and bridging — The 832 I/O pins accommodate multiple high-pin-count interfaces and board-level connectivity.
• Complex control systems — Combine abundant logic and on-chip RAM to implement advanced control logic, state machines, and deterministic processing pipelines.

Unique Advantages

• High logic density: 2,586,150 logic elements enable consolidation of large designs onto a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 391 Mbits of embedded RAM supports large buffers and lookup tables without immediate external memory needs.
• Extensive I/O: 832 user I/O pins provide flexible connectivity for multi-interface systems and complex board integrations.
• High-pin-count FCBGA package: The 2104-FCBGA (47.5 × 47.5 mm) package supports dense routing and high I/O density for system-level designs.
• Controlled core voltage: Narrow supply range (825 mV–876 mV) enables predictable power planning and core voltage management.
• Extended-grade operation: Specified 0 °C to 100 °C operating range for deployments requiring extended temperature support.

Why Choose XCVU9P-2FLGA2104E?

The XCVU9P-2FLGA2104E combines a very high logic element count, large embedded memory, and extensive I/O in a single Virtex® UltraScale+™ FPGA package. This configuration is well suited to designs that require high integration density and significant on-chip resources to reduce external components and simplify system architecture.

For engineering and procurement teams targeting scalable, robust FPGA-based solutions, this extended-grade, RoHS-compliant device offers a solid platform where large programmable fabric, substantial RAM, and high I/O capacity are primary design drivers.

Request a quote or submit an inquiry for pricing and availability of the XCVU9P-2FLGA2104E to begin integrating this Virtex® UltraScale+™ FPGA into your next design.