XCVU9P-2FLGA2577E

The XCVU9P-2FLGA2577E is a Virtex® UltraScale+™ FPGA offering high-density programmable logic and a large embedded memory footprint. It combines 2,586,150 logic elements, approximately 391 Mbits of embedded memory, and 448 user I/O to support complex, parallelizable hardware designs.

Packaged in a 2577-FCBGA (52.5×52.5) surface-mount package and specified for extended-grade operation, this device is suited to applications that require substantial logic resources, significant on-chip RAM, and a high pin count while operating within the specified voltage and temperature ranges.

Key Features

• Core Logic Capacity — 2,586,150 logic elements provide a high-density fabric for implementing large-scale, custom digital designs.
• Embedded Memory — Approximately 391 Mbits of on-chip RAM for buffering, caching, and high-speed data storage close to logic.
• I/O Resources — 448 user I/O pins to support extensive external interfacing and parallel connectivity.
• Package — 2577-BBGA / 2577-FCBGA (52.5×52.5) surface-mount package for high-pin-count board-level integration.
• Power Supply Range — Device supply specified between 825 mV and 876 mV for core operation.
• Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance — RoHS compliant, supporting regulatory requirements for lead-free manufacturing.

Unique Advantages

• High Logic Density: 2,586,150 logic elements enable consolidation of large designs onto a single device, reducing board count and system complexity.
• Substantial On‑Chip Memory: Approximately 391 Mbits of embedded RAM minimizes external memory dependency and supports high-throughput data paths.
• Extensive I/O Count: 448 I/O pins provide flexibility for wide parallel interfaces and multiple high-bandwidth connections.
• Compact, High‑Pin Package: 2577-FCBGA (52.5×52.5) package balances high integration with standard surface-mount assembly.
• Designed for Extended Operation: Extended-grade qualification and a 0 °C to 100 °C operating range address a broad set of thermal environments.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose XCVU9P-2FLGA2577E?

The XCVU9P-2FLGA2577E positions itself as a high-capacity, highly integrated FPGA solution for designs that demand large logic resources, significant embedded memory, and a high I/O complement. Its extended-grade specification and surface-mount 2577-FCBGA package make it suitable for projects that require dense integration while operating within the documented temperature and supply ranges.

This device offers long-term value through the combination of scalable logic capacity, on-chip RAM, and a robust I/O count—beneficial for teams aiming to consolidate functionality, reduce external components, and simplify board-level routing in advanced digital designs.

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