XCVU9P-2FLGA2104I

The XCVU9P-2FLGA2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC provided in a 2104-FCBGA package. It delivers a large programmable fabric with substantial embedded memory, high I/O count, and an industrial operating temperature range for demanding embedded and system-level designs.

Key Features

• Core Architecture Virtex® UltraScale+ FPGA architecture as indicated by the product name.
• Logic Capacity Approximately 2,586,150 logic elements and 147,780 configurable logic blocks (CLBs) to support large-scale programmable logic implementations.
• On-chip Memory Approximately 391 Mbits of embedded memory for buffering, lookup tables, and state storage.
• I/O and Package 416 general-purpose I/O in a 2104-FCBGA (47.5 × 47.5 mm) package, enabling dense external connectivity in a single FCBGA footprint.
• Power Core voltage supply range from 825 mV to 876 mV to match specific low-voltage design domains.
• Thermal and Grade Industrial grade device rated for operation from −40°C to 100°C.
• Mounting & Compliance Surface-mount package construction and RoHS compliant.

Typical Applications

• High-density digital signal processing — Utilizes the large logic element count and extensive on-chip memory for complex DSP pipelines and data buffering.
• High-throughput I/O systems — 416 I/O pins in the 2104-FCBGA package support designs requiring substantial external interfacing and parallel connectivity.
• Industrial control and automation — Industrial temperature range (−40°C to 100°C) and robust packaging suit deployment in industrial environments.
• System integration and prototyping — Large programmable fabric and embedded memory enable integration of multiple functions and rapid hardware prototyping within a single device.

Unique Advantages

• Extensive programmable logic: Approximately 2.6 million logic elements provide capacity for large, complex logic designs without immediate migration to multi-FPGA systems.
• Substantial embedded memory: Roughly 391 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage needs.
• High I/O in a compact FCBGA: 416 I/Os in a 2104-FCBGA (47.5 × 47.5 mm) package balance connectivity and board space efficiency.
• Industrial temperature rating: Specified operation from −40°C to 100°C supports use in temperature-challenging deployments.
• Low-voltage core operation: Core supply range of 825 mV to 876 mV aligns with modern low-voltage power domains.
• RoHS compliant and surface-mount: Meets RoHS requirements and is designed for standard surface-mount assembly processes.

Why Choose XCVU9P-2FLGA2104I?

The XCVU9P-2FLGA2104I positions itself as a high-capacity, industrial-grade FPGA option within the Virtex® UltraScale+ family, offering a combination of large programmable logic resources, significant on-chip memory, and a high I/O count in a 2104-FCBGA package. These attributes make it suitable for engineers and system designers who need substantial on-chip resources and robust environmental tolerance for complex, space-constrained applications.

With defined core voltage requirements and RoHS compliance, the device supports integration into modern low-voltage systems and assembly processes while providing scalability for evolving design requirements.

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