XCVU9P-2FLGA2577I

The XCVU9P-2FLGA2577I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, supplied in a 2577-FCBGA (52.5×52.5 mm) package. It delivers a large programmable fabric with substantial embedded memory and a high I/O count for designs that require significant on-chip resources.

With 2,586,150 logic elements, approximately 391 Mbits of embedded memory and 448 I/Os, this industrial-grade, surface-mount FPGA addresses applications that demand dense logic capacity, abundant local memory and broad connectivity while operating across a wide industrial temperature range.

Key Features

• Logic Capacity: 2,586,150 logic elements provided to implement large, complex digital designs and high-density programmable logic.
• Embedded Memory: Approximately 391 Mbits of on-chip RAM to support data buffering, large lookup tables and local storage for high-throughput designs.
• I/O Count: 448 I/Os for extensive external device interfacing, board-level connectivity and high-pin-count system integration.
• Package & Mounting: 2577-BBGA, FCBGA package (supplier package 2577-FCBGA, 52.5×52.5 mm) in a surface-mount form factor for dense PCB implementations.
• Voltage Supply: Specified operating voltage range of 0.825–0.876 V to match precise power-rail requirements.
• Operating Temperature: Industrial temperature rating from −40°C to 100°C for deployment in temperature-variable environments.
• Regulatory Compliance: RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing: Use the large logic fabric and on-chip memory to implement complex custom processing pipelines and data-paths.
• High I/O system integration: Leverage 448 I/Os for interfacing with multiple peripherals, mezzanine cards or high-pin-count boards.
• Embedded memory–intensive designs: Deploy the ~391 Mbits of embedded RAM for buffering, packet processing or large LUT-based functions.

Unique Advantages

• Substantial logic resources: 2,586,150 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Large on-chip memory: Approximately 391 Mbits of embedded RAM minimizes external memory dependencies and shortens signal paths for lower-latency designs.
• High connectivity: 448 I/Os provide flexibility for complex system interfaces and dense external device coupling.
• Industrial temperature rating: −40°C to 100°C support deployment in demanding thermal environments where extended temperature range is required.
• Robust packaging: 2577-FCBGA (52.5×52.5 mm) surface-mount package supports high-density PCB layouts and system-level integration.
• RoHS compliance: Environmentally compliant manufacturing to align with common production standards.

Why Choose XCVU9P-2FLGA2577I?

The XCVU9P-2FLGA2577I positions itself as a high-capacity programmable logic device for designs that require extensive logic resources, significant on-chip RAM and a broad I/O complement in an industrial-grade package. Its specified voltage range and temperature rating make it suitable for applications that need precise power delivery and reliable operation across temperature extremes.

This device is appropriate for engineering teams consolidating complex digital functions onto a single FPGA, integrating high-pin-count systems, or implementing memory-intensive logic. The combination of large logic element count, substantial embedded memory and robust packaging provides a scalable platform for demanding system designs.

Request a quote or submit a request for pricing and availability for the XCVU9P-2FLGA2577I to get detailed lead-time and procurement information.