XCVU9P-1FLGC2104E

The XCVU9P-1FLGC2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 2104-FCBGA package. It provides a large programmable fabric with a high count of logic elements and substantial on-chip memory, suited for designs that require significant programmable resources and I/O density.

Key electrical and mechanical characteristics provided include a specified core voltage supply range, surface-mount FCBGA package dimensions, extended-grade temperature rating, and RoHS compliance.

Key Features

• Logic Capacity  2,586,150 logic elements (cells) for large-scale programmable logic implementations.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM (391,168,000 bits) to support data buffering, packet processing, and state storage within the FPGA fabric.
• I/O Density  416 user I/O pins to support wide interfaces and multiple parallel channels.
• Power Supply  Specified core voltage supply range of 825 mV to 876 mV for device operation.
• Package and Mounting  2104-BBGA / 2104-FCBGA package in a surface-mount form factor; supplier device package noted as 2104-FCBGA (47.5x47.5).
• Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density logic systems  Use the 2,586,150 logic elements and extensive embedded memory to implement complex digital processors or large custom logic blocks.
• Multi-channel I/O interfaces  Leverage 416 I/Os to connect multiple parallel data paths, sensors, or external interfaces.
• On-chip buffering and packet handling  Approximately 391 Mbits of embedded RAM enable substantial on-chip data storage for buffering, queuing, and real-time data manipulation.

Unique Advantages

• Substantial programmable capacity: Over two and a half million logic elements provide headroom for large-scale custom logic without immediate need for external logic expansion.
• Large on-chip memory: Approximately 391 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 416 I/Os enable broad connectivity for multi-lane interfaces and parallel signal routing.
• Surface-mount FCBGA packaging: The 2104-FCBGA package (47.5x47.5) supports compact board designs while delivering high pin density.
• Design-grade operating range: Extended grade with 0 °C to 100 °C operation and RoHS compliance for regulatory alignment.

Why Choose XCVU9P-1FLGC2104E?

The XCVU9P-1FLGC2104E positions itself as a high-capacity, highly connected FPGA option within the Virtex® UltraScale+™ family, offering a combination of large logic element count, significant embedded memory, and extensive I/O in a 2104-FCBGA surface-mount package. Its specified supply voltage range and extended-grade temperature rating make it appropriate for designs that require predictable electrical and thermal behavior within the provided limits.

This part is well-suited for development teams and procurement departments targeting projects that need large on-chip resources and high I/O density, while maintaining RoHS compliance and leveraging the form factor of a 2104-FCBGA package.

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