XCVU9P-1FLGB2104I

The XCVU9P-1FLGB2104I is a high-capacity Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 2104-FCBGA package (47.5×47.5 mm). Its combination of millions of logic elements, substantial embedded memory and a large I/O count makes it suitable for complex, logic-dense industrial designs that require significant on-chip resources and high interface density.

Key Features

• Logic Capacity  Approximately 2,586,150 logic elements to implement large-scale digital designs and parallel processing blocks.
• Logic Blocks  147,780 logic blocks for finely partitioned logic and hierarchy in complex implementations.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• I/O Density  702 I/O pins to support a wide range of interfaces and parallel connections to external devices or subsystems.
• Power and Core Supply  Specified core supply voltage range of 825 mV to 876 mV for predictable power provisioning and board-level power design.
• Package and Mounting  2104-BBGA, FCBGA surface-mount package (supplier package 2104-FCBGA, 47.5×47.5 mm) for high-density board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial-environment thermal requirements.
• Compliance  RoHS compliant for adherence to common environmental regulations.

Typical Applications

• Industrial Automation  Implement large-scale control logic, real-time processing and multiple sensor/actuator interfaces using the device’s high logic and I/O capacity.
• Signal Processing  Support compute-intensive, parallel processing pipelines and local buffering with abundant logic elements and approximately 391 Mbits of on-chip RAM.
• Networking and Communications  Enable high-density protocol interfacing and parallel data paths across many I/O pins for infrastructure and edge communication equipment.
• Complex Prototyping  Prototype multi-million-element digital systems and system-on-chip concepts that require extensive programmable resources and I/O integration.

Unique Advantages

• Large programmable fabric: Approximately 2.59 million logic elements enable implementation of extensive custom logic and parallel architectures on a single device.
• Substantial embedded memory: Around 391 Mbits of on-chip RAM reduces dependency on external memory for many buffering and lookup needs.
• High I/O count: 702 I/O pins provide flexibility to connect multiple high-bandwidth interfaces and parallel buses directly to the FPGA.
• Industrial-grade thermal range: Operation from −40 °C to 100 °C supports deployment in industrial environments with wide temperature variation.
• Compact high-density package: 2104-FCBGA (47.5×47.5 mm) packaging allows integration of a high-resource FPGA into space-constrained boards.
• RoHS compliant: Meets common environmental compliance requirements for assembly and shipment.

Why Choose XCVU9P-1FLGB2104I?

The XCVU9P-1FLGB2104I delivers a balance of large logic capacity, extensive embedded memory and high I/O density in an industrial-rated FPGA package. It is positioned for designs that require significant on-chip resources and robust operation across a wide temperature range.

For engineering teams targeting complex, logic-intensive systems—where minimizing external components and maximizing on-chip performance matter—this device provides a scalable platform that aligns with industrial deployment requirements.

Request a quote or submit a sales inquiry today to obtain pricing and availability for XCVU9P-1FLGB2104I.