XCVU9P-1FLGA2104I

The XCVU9P-1FLGA2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD supplied in a 2104-FCBGA package. It is an industrial-grade, surface-mount FPGA designed to deliver high logic density, substantial on-chip memory, and a large I/O count for complex, embedded designs.

This device provides approximately 2,586,150 logic elements, approximately 391 Mbits of embedded memory, and up to 832 I/O pins. It operates from a core voltage range of 825 mV to 876 mV and across an operating temperature range of -40 °C to 100 °C, making it suitable for demanding industrial environments.

Key Features

• Core Logic  Approximately 2,586,150 logic elements to implement large-scale custom logic and complex digital functions.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Capacity  Up to 832 I/O pins to support wide connectivity and multiple parallel interfaces.
• Power  Core voltage supply range from 825 mV to 876 mV to match system power architecture requirements.
• Package and Mounting  2104-FCBGA (47.5 × 47.5 mm) supplier device package; 2104-BBGA package case; surface-mount mounting type for board-level assembly.
• Temperature and Grade  Industrial-grade device rated for operation from -40 °C to 100 °C for temperature-critical deployments.
• Compliance  RoHS compliant for materials and manufacturing considerations.

Typical Applications

• Data Processing & Acceleration  Use the large logic element count and embedded memory to implement custom data-paths, accelerators, and packet processing engines.
• High-Density I/O Systems  Leverage up to 832 I/O pins for multi-channel interfaces, protocol bridging, and high-throughput connectivity.
• Industrial Control & Automation  Industrial-grade temperature range and robust packaging suit control systems and factory automation equipment requiring reliable operation.

Unique Advantages

• High Logic Capacity: The device’s approximately 2.6 million logic elements enable implementation of complex, large-scale designs on a single FPGA.
• Substantial On-Chip Memory: Approximately 391 Mbits of embedded RAM reduces dependence on external memory and supports deep buffering and state retention.
• Extensive I/O: 832 I/O pins provide flexibility for multiple concurrent interfaces, sensor arrays, or parallel data lanes.
• Industrial Temperature Rating: Rated from -40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact High-Pin-Count Package: The 2104-FCBGA (47.5 × 47.5 mm) package delivers high integration density in a surface-mount form factor.
• RoHS Compliant: Conforms to RoHS requirements for material compliance in manufacturing.

Why Choose XCVU9P-1FLGA2104I?

The XCVU9P-1FLGA2104I positions itself as a high-density, industrial-grade FPGA for designers who require a combination of large logic capacity, substantial embedded memory, and a high I/O count in a single, surface-mount package. Its specified voltage range and operating temperature make it suitable for robust embedded and industrial applications.

This device is well suited for teams developing complex custom accelerators, high-throughput interface hubs, or industrial control systems that benefit from on-chip memory and extensive I/O. Choosing this FPGA provides a scalable platform with the integration needed to consolidate functions and simplify system architecture.

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