XCVU7P-L2FLVB2104E

The XCVU7P-L2FLVB2104E is a Virtex UltraScale+ field programmable gate array (FPGA) designed for applications requiring very large logic capacity and substantial embedded memory. This extended-grade, surface-mount device integrates 1,724,100 logic elements and approximately 260.8 Mbits of on-chip RAM to address dense, memory-rich designs.

With 702 user I/O pins and a 2104-FCBGA package, the device is suited to system designs that demand high I/O bandwidth and compact board-level integration while operating across an extended temperature range.

Key Features

• Core Logic Provides 1,724,100 logic elements to implement large-scale programmable logic and complex architectures.
• Embedded Memory Includes approximately 260.8 Mbits of on-chip RAM for data buffering, packet storage, and memory-intensive functions.
• I/O Capacity 702 I/O pins support broad connectivity options for interfaces and system integration.
• Package and Mounting Available in a 2104-BBGA / 2104-FCBGA package (2104-FCBGA (47.5x47.5)) and designed for surface-mount assembly.
• Power Supply Range Operates with a core voltage supply between 698 mV and 742 mV to match system power rails and design requirements.
• Temperature and Grade Rated as Extended grade with an operating range of 0 °C to 110 °C for applications requiring wider-than-commercial temperature performance.
• Compliance RoHS compliant, supporting lead-free and environmentally conscious assembly processes.

Typical Applications

• High-density programmable logic systems — Large-scale FPGA implementations that require extensive logic resources for complex algorithms and datapaths.
• Memory-intensive designs — Designs that benefit from significant on-chip RAM for buffering, frame storage, or large lookup tables.
• I/O-rich interface bridging — Systems that need many external interfaces or parallel connections enabled by a high I/O count.
• Extended-temperature embedded systems — Deployments that require extended-grade operation between 0 °C and 110 °C.

Unique Advantages

• Large logic capacity: 1,724,100 logic elements allow consolidation of multi-FPGA functions into a single device, simplifying system architecture.
• Substantial on-chip memory: Approximately 260.8 Mbits of RAM reduce external memory needs and improve latency for data-critical functions.
• High I/O density: 702 I/O pins enable wide connectivity and flexible interface options without sacrificing board space.
• Extended temperature rating: 0 °C to 110 °C operation supports designs that require broader thermal tolerance than standard commercial parts.
• Compact FCBGA package: 2104-FCBGA packaging provides a high-pin-count solution in a board-friendly surface-mount form factor.
• RoHS compliant: Facilitates environmentally compliant manufacturing and assembly processes.

Why Choose XCVU7P-L2FLVB2104E?

The XCVU7P-L2FLVB2104E combines very large programmable logic resources with substantial embedded memory and a high I/O count in a surface-mount FCBGA package. Its extended-grade operating range and RoHS compliance make it a practical choice for designs that need both capacity and wider temperature tolerance.

This part is well suited to system architects and engineers looking to integrate dense logic, large on-chip data storage, and many external interfaces into a single FPGA device, providing scalability and consolidation opportunities within a single package footprint.

Request a quote or submit your specifications to receive pricing and availability for the XCVU7P-L2FLVB2104E. Our team can provide lead-time information and support for procurement and design planning.