XCVU7P-L2FLVC2104E

The XCVU7P-L2FLVC2104E is a Virtex® UltraScale+™ FPGA IC offering a high density of programmable logic and on-chip memory in a 2104-FCBGA surface-mount package. It provides approximately 1,724,100 logic elements and roughly 261 Mbits of embedded RAM, combined with 416 I/O pins to support complex, high-capacity designs.

Designed for extended-grade applications, the device operates over a 0 °C to 110 °C temperature range and is RoHS compliant. The supply voltage range is specified as 698 mV to 742 mV, and the package is supplied as a 2104-FCBGA (47.5 × 47.5 mm), listed with a 2104-BBGA/FCBGA case.

Key Features

• Core Logic  Approximately 1,724,100 logic elements (cells) enable large-scale programmable logic integration for dense digital designs.
• Embedded Memory  Approximately 261 Mbits of on-chip RAM (260,812,800 bits) for buffering, lookup tables, and data processing without off-chip memory dependence.
• I/O Connectivity  416 user I/O pins provide a high degree of external interfacing and signal routing capacity.
• Package  2104-FCBGA supplier package (47.5 × 47.5 mm) referenced as 2104-BBGA/FCBGA; surface-mount mounting type for high-density PCB assembly.
• Power  Specified supply voltage range of 698 mV to 742 mV.
• Temperature & Grade  Extended-grade device with an operating temperature range of 0 °C to 110 °C.
• Compliance  RoHS compliant for environmental and regulatory alignment.

Unique Advantages

• High logic capacity: Approximately 1,724,100 logic elements support large-scale, complex logic implementations within a single device.
• Substantial on-chip memory: Around 261 Mbits of embedded RAM reduces reliance on external memory and simplifies board-level memory architecture.
• Extensive I/O count: 416 I/O pins enable dense, flexible connectivity for multi-channel and multi-interface designs.
• High-density package: 2104-FCBGA (47.5 × 47.5 mm) provides a compact footprint for high-pin-count FPGA deployment on space-constrained PCBs.
• Extended-grade operation: Specified 0 °C to 110 °C operating range and extended grade designation support applications requiring elevated temperature tolerance.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCVU7P-L2FLVC2104E?

The XCVU7P-L2FLVC2104E positions itself as a high-density, high-connectivity FPGA solution for designs that require large logic capacity, substantial embedded memory, and abundant I/O in a single, surface-mount package. Its extended-grade rating and broad supply and temperature specifications make it suitable for applications that demand durable, long-lived components.

Engineers and procurement teams looking for a scalable, integrated programmable-logic device will find the combination of approximately 1.7M logic elements, ~261 Mbits of on-chip RAM, and 416 I/Os valuable for consolidating functions, simplifying board design, and reducing external component count.

Request a quote or submit an inquiry to obtain pricing and availability for the XCVU7P-L2FLVC2104E.