XCVU7P-3FLVC2104E

The XCVU7P-3FLVC2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD offered in a 2104-BBGA/2104-FCBGA package. It provides very high logic density and substantial embedded memory, delivered in a surface-mount FCBGA footprint for board-level integration.

With approximately 1,724,100 logic elements, roughly 261 Mbits of on-chip RAM and 416 user I/O signals, this extended-grade device targets applications that require large programmable logic capacity, significant embedded memory and broad I/O connectivity while operating across a 0°C to 100°C range.

Key Features

• FPGA Core Virtex® UltraScale+™ field programmable gate array architecture in an AMD-manufactured device designed for high-density programmable logic implementations.
• Logic Capacity Approximately 1,724,100 logic elements for complex, large-scale logic designs and integration of multiple functions on a single device.
• Embedded Memory Approximately 261 Mbits of on-chip RAM to support buffering, data storage and memory-intensive processing within the FPGA fabric.
• I/O Resources 416 user I/O pins to support extensive board-level connectivity and multiple peripheral interfaces.
• Power Supported core supply range from 873 mV to 927 mV, enabling precise power planning and regulator selection.
• Package & Mounting Surface-mount 2104-FCBGA (47.5 × 47.5 mm) package (2104-BBGA, FCBGA case) for compact, high-density board integration.
• Temperature & Grade Extended-grade device rated for 0°C to 100°C operating temperature range.
• Compliance RoHS compliant.

Typical Applications

• High-density programmable logic — Use the large logic element count to implement complex custom digital functions, multi-core accelerators or state-rich control logic on a single FPGA.
• Memory-intensive designs — Leverage approximately 261 Mbits of embedded memory for on-chip buffering, packet queues or intermediate data storage.
• I/O-rich interface designs — Employ 416 I/O pins to bridge multiple subsystems, implement wide parallel interfaces or support numerous peripheral channels.
• Compact board integration — The 2104-FCBGA (47.5 × 47.5 mm) surface-mount package supports dense PCB layouts where board space and integration density are priorities.

Unique Advantages

• High logic integration: Approximately 1,724,100 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
• Substantial on-chip memory: Roughly 261 Mbits of embedded RAM enables significant local storage and buffering without external memory for many use cases.
• Extensive I/O count: 416 user I/O provides flexibility to connect to numerous peripherals, interfaces and board-level signals.
• Compact FCBGA packaging: The 2104-FCBGA (47.5 × 47.5 mm) surface-mount package balances high pin count with a manageable board footprint.
• Extended operating range: Extended grade with 0°C to 100°C operation supports deployments within that industrial temperature window.
• RoHS compliant: Meets RoHS requirements for environmental and manufacturing considerations.

Why Choose XCVU7P-3FLVC2104E?

The XCVU7P-3FLVC2104E positions itself as a high-density Virtex® UltraScale+™ FPGA option that combines a very large logic fabric, substantial on-chip memory and extensive I/O in a single 2104-FCBGA surface-mount package. Its extended-grade rating and defined supply voltage range make it suitable for designs that require predictable electrical and thermal planning within the specified operating window.

This device is appropriate for engineers and system designers seeking to consolidate complex digital functionality, implement memory-heavy processing tasks and support multiple interfaces without spreading functions across multiple components—helping to simplify BOMs and PCB routing in high-capacity FPGA-based designs.

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