XCVU7P-2FLVC2104I

The XCVU7P-2FLVC2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD, supplied in a 2104-FCBGA package. It delivers very large logic capacity, substantial embedded memory, and a high I/O count in a surface-mount FCBGA footprint.

Specified for industrial-grade use with a wide operating temperature range and RoHS compliance, this device is suited for designs that require significant on-chip resources and robust environmental tolerance.

Key Features

• Core / Logic Capacity  Approximately 1,724,100 logic elements provide large-scale programmable logic for complex designs.
• Embedded Memory  Approximately 260.8 Mbits of on-chip RAM for data buffering, state storage, and embedded processing tasks.
• I/O Density  416 I/O pins offer broad external connectivity for high-channel-count interfaces and dense board-level integration.
• Power Supply  Core supply voltage specified from 825 mV to 876 mV to meet device power requirements.
• Package & Mounting  2104-FCBGA package (47.5 × 47.5 mm) in a surface-mount form factor for compact, high-density system assemblies.
• Industrial Grade & Temperature Range  Rated for industrial use with an operating temperature range of −40 °C to 100 °C.
• Regulatory Compliance  RoHS-compliant for materials and manufacturing suitability in regulated supply chains.

Typical Applications

• Industrial Control  Industrial systems that require reliable operation across −40 °C to 100 °C can use the device’s large logic capacity and I/O to implement complex control algorithms and machine interfaces.
• High-density Signal Processing  Designs that demand significant on-chip memory and logic can leverage approximately 260.8 Mbits of embedded RAM and 1.7M logic elements for buffering, DSP, and data-path implementations.
• Custom Embedded Systems  Boards requiring many external connections can take advantage of 416 I/O pins and the compact 2104-FCBGA package for space-constrained, feature-rich products.

Unique Advantages

• Large-scale integration: The combination of roughly 1.7 million logic elements and extensive embedded RAM reduces the need for external components and simplifies system architecture.
• High I/O count: 416 I/O pins enable dense interfacing to peripherals, sensors, and high-channel-count front-ends without sacrificing board layout flexibility.
• Industrial thermal tolerance: Rated for −40 °C to 100 °C operation, supporting deployments in demanding environmental conditions.
• Compact FCBGA package: The 2104-FCBGA (47.5 × 47.5 mm) delivers high resource density in a surface-mount form factor suitable for modern PCB designs.
• Regulatory readiness: RoHS compliance helps streamline integration into environmentally regulated product lines.

Why Choose XCVU7P-2FLVC2104I?

The XCVU7P-2FLVC2104I positions itself as a high-capacity, industrial-grade FPGA option from AMD, combining expansive programmable logic, substantial embedded memory, and a broad I/O complement in a compact FCBGA package. Its specified core voltage range and wide operating temperature make it suitable for robust embedded systems that demand on-chip resources and environmental resilience.

This device is appropriate for engineering teams building complex control, signal processing, or multi-interface systems that benefit from integrated memory, extensive logic, and a high pin-count package while maintaining regulatory and temperature considerations.

Request a quote or submit a pricing inquiry to evaluate XCVU7P-2FLVC2104I for your next design.