XCVU7P-2FLVA2104I

The XCVU7P-2FLVA2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC designed for high-density digital designs. It integrates approximately 1,724,100 logic elements and approximately 260.8 Mbits of embedded memory, providing substantial on-chip resources for complex implementations.

With 832 I/O pins, a 2104-FCBGA package (47.5×47.5 mm), industrial-grade operating range and RoHS compliance, this device targets systems that require high logic capacity, significant embedded RAM and robust environmental tolerance.

Key Features

• Core Logic  Approximately 1,724,100 logic elements provide extensive programmable fabric for large-scale logic and algorithm implementation.
• Embedded Memory  Approximately 260.8 Mbits of on-chip RAM for buffering, caches and data storage without relying on external memory.
• I/O Capacity  832 I/O pins delivered in a high-density ball grid array package to support broad interfacing requirements.
• Package & Mounting  2104-FCBGA (2104-BBGA compatible designation) in a 47.5 × 47.5 mm footprint, designed for surface-mount assembly.
• Power  Core supply range specified at 0.825 V to 0.876 V to match system power architectures.
• Temperature & Grade  Industrial-grade qualification with an operating temperature range of −40 °C to 100 °C for use in demanding environments.
• Compliance  RoHS compliant to meet common environmental and manufacturability requirements.

Typical Applications

• High-density digital processing  Deploy where large numbers of logic elements (≈1,724,100) and substantial on-chip RAM (≈260.8 Mbits) are required for complex algorithms and data handling.
• Interface aggregation  Use the 832 I/O pins to consolidate multiple peripheral interfaces or to implement wide parallel data buses with minimal external multiplexing.
• Embedded system acceleration  Leverage the combination of logic and memory resources to offload compute- or memory-intensive functions from host processors.

Unique Advantages

• High on-chip integration: The combination of ≈1.72M logic elements and ≈260.8 Mbits of embedded RAM reduces dependency on external logic and memory, simplifying board-level design.
• Extensive I/O density: 832 I/O pins allow flexible, high-bandwidth connectivity options without extensive I/O expansion components.
• Industrial temperature range: Rated from −40 °C to 100 °C to support deployments in a wide range of operating environments.
• Compact high-density package: 2104-FCBGA (47.5×47.5 mm) offers a condensed footprint for systems needing substantial logic in a single-package solution.
• Controlled core voltage: Core supply range of 0.825 V to 0.876 V enables consistent integration with regulated power domains.
• Environmental compliance: RoHS compliance facilitates use in assemblies targeting common regulatory and manufacturing standards.

Why Choose XCVU7P-2FLVA2104I?

The XCVU7P-2FLVA2104I positions itself as a high-capacity FPGA option that brings together a very large logic fabric, significant embedded RAM, and a high pin count in a single industrial-grade package. This balance of resources supports complex designs that require on-chip compute and memory without excessive external components.

Engineers and procurement teams selecting this device benefit from a scalable platform for advanced digital systems that need robust temperature tolerance, precise core power requirements and high I/O flexibility—delivering long-term design headroom and straightforward board integration.

Request a quote or submit a sales inquiry to evaluate XCVU7P-2FLVA2104I for your next high-density FPGA design.