XCVU7P-1FLVB2104I

The XCVU7P-1FLVB2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, supplied in a 2104-FCBGA package. It provides a large logic capacity, substantial embedded memory, and a high I/O count for complex, industrial-grade FPGA designs.

With an operating range from -40 °C to 100 °C and a specified core supply voltage window of 825 mV to 876 mV, this surface-mount FPGA targets applications that require significant on-chip resources and extended temperature operation.

Key Features

• Logic Capacity  Approximately 1,724,100 logic elements to support large, complex digital designs.
• Embedded Memory  Approximately 260.8 Mbits of on-chip RAM for frame buffers, packet buffering, and other memory-intensive functions.
• I/O Resources  702 I/O pins to accommodate extensive external interfacing and multi-channel connectivity.
• Package & Mounting  2104-FCBGA package (47.5 × 47.5 mm) supplied in a surface-mount form factor for board-level integration.
• Industrial Grade  Industrial-grade device with an operating temperature range of -40 °C to 100 °C for deployments in temperature-challenging environments.
• Power Supply  Specified core voltage supply range of 825 mV to 876 mV to match system power requirements.
• RoHS Compliance  RoHS-compliant construction to meet environmental restrictions on hazardous substances.

Typical Applications

• High-density FPGA Designs  Systems that require large logic capacity and significant on-chip RAM for complex programmable logic and data processing.
• Multi-interface Systems  Designs needing extensive external connectivity can use the 702 I/O pins to implement multiple interfaces and peripheral connections.
• Industrial Control and Processing  Applications that benefit from industrial-grade temperature operation and robust packaging for reliable long-term operation.

Unique Advantages

• Substantial Logic Resources: Approximately 1.7 million logic elements enable implementation of large-scale, highly integrated logic functions without external ASICs.
• Large Embedded Memory: Approximately 260.8 Mbits of on-chip RAM reduce dependency on external memory for buffering and data-intensive tasks.
• Extensive I/O Count: 702 I/Os allow flexible system partitioning and support for multiple peripheral and interface connections on a single device.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to support deployments in environments with wide temperature variation.
• Compact, High-pin Package: 2104-FCBGA (47.5 × 47.5 mm) provides a dense pinout in a surface-mount package suitable for space-constrained PCBs.
• Environmental Compliance: RoHS-compliant construction aligns with regulatory requirements for hazardous substance restrictions.

Why Choose XCVU7P-1FLVB2104I?

The XCVU7P-1FLVB2104I combines large logic element capacity, substantial embedded memory, and a high number of I/Os in an industrial-grade, surface-mount FCBGA package. These attributes make it well suited for designs that require high integration density and reliable operation across an extended temperature range.

Designed and supplied by AMD, this Virtex® UltraScale+™ FPGA offers a compact package footprint with a well-defined supply voltage window and compliance with RoHS, providing a clear platform choice for engineering teams developing advanced programmable digital systems.

Request a quote or submit an inquiry for XCVU7P-1FLVB2104I to receive pricing and availability information tailored to your project needs.