XCVU5P-L2FLVB2104E

The XCVU5P-L2FLVB2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 2104-ball FCBGA package. It provides a high count of programmable logic resources, substantial embedded memory, and a large I/O complement for complex, high-density designs.

This device is intended for applications that require significant logic capacity, on-chip memory and broad I/O connectivity while operating within an extended temperature range and a low-voltage core supply window.

Key Features

• Core Logic: Approximately 1,313,763 logic elements, offering substantial programmable fabric for large-scale logic and control implementations.
• Embedded Memory: Approximately 191 Mbits of on-chip RAM to support buffering, look-up tables, and memory-intensive logic functions.
• I/O Capacity: Up to 702 user I/O pins to support extensive peripheral and high-density board connections.
• Package and Mounting: 2104-BBGA, FCBGA package (supplier package: 2104-FCBGA, 47.5×47.5 mm) with surface-mount mounting for compact, high-pin-count board integration.
• Power: Core voltage supply range from 698 mV to 876 mV to match system power architectures requiring low-voltage FPGA cores.
• Operating Range and Grade: Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance: RoHS compliant.

Typical Applications

• High-density logic and control: Use where large programmable logic capacity is required to implement complex control systems and custom logic engines.
• Memory-intensive processing: Suitable for designs that leverage substantial on-chip RAM for buffering, packet processing, or temporary data storage.
• I/O-rich systems: Ideal for applications requiring many external interfaces or parallel connections thanks to up to 702 I/O pins.
• Compact, high-pin-count board designs: The 2104-FCBGA (47.5×47.5 mm) package supports dense integration on surface-mount PCBs.

Unique Advantages

• High logic density: Approximately 1.3 million logic elements enable consolidation of large logic functions into a single device, reducing board-level complexity.
• Large on-chip memory: Around 191 Mbits of embedded RAM minimizes external memory dependence for many buffering and state storage needs.
• Extensive I/O: Up to 702 I/O pins provide flexibility for interfacing with many peripherals, sensors, and external subsystems.
• Compact FCBGA package: 2104-ball FCBGA (47.5×47.5 mm) delivers a high pin count in a compact footprint for space-constrained designs.
• Extended operating range: Extended-grade designation with a 0 °C to 100 °C operating temperature range suitable for many commercial and embedded environments.
• Regulatory compliance: RoHS compliance supports designs targeting environmental and safety compliance requirements.

Why Choose XCVU5P-L2FLVB2104E?

The XCVU5P-L2FLVB2104E positions itself as a high-capacity, integration-focused FPGA for designs that demand large programmable logic resources, significant on-chip memory and extensive I/O. Its FCBGA 2104 package and surface-mount form factor enable dense board-level integration while the extended grade and RoHS compliance support many embedded system requirements.

This device is well suited for engineering teams building complex, memory- and I/O-heavy systems that benefit from consolidating functionality into a single, high-density FPGA to reduce component count and simplify board architecture.

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