XCVU5P-L2FLVA2104E

The XCVU5P-L2FLVA2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) manufactured by AMD. It provides a large on-chip resource set—over 1.31 million logic elements and approximately 191 Mbits of embedded memory—packaged in a 2104-FCBGA (47.5 × 47.5 mm) surface-mount package.

This device is designed for designs that require high logic capacity, substantial embedded RAM, and a high-count I/O interface, while operating within a 0 °C to 100 °C range and a core supply range of 698 mV to 876 mV.

Key Features

• Core Logic Capacity  1,313,763 logic elements (as specified) to support complex programmable logic and large-scale designs.
• Embedded Memory  Approximately 191 Mbits of on-chip RAM, enabling larger data buffering and local storage without external memory.
• I/O Density  832 I/O pins to support high pin-count interfaces and dense peripheral connectivity.
• Package  2104-FCBGA package (47.5 × 47.5 mm) providing a high-pin-count, space-efficient surface-mount solution.
• Power Supply Range  Core voltage supply range of 698 mV to 876 mV for compatibility with defined power architectures.
• Operating Temperature  Rated for operation from 0 °C to 100 °C, suitable for temperature environments within this range.
• Mounting and Grade  Surface mount device supplied in an Extended grade configuration.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density compute and acceleration  Suitable for FPGA-based acceleration tasks that require large numbers of logic elements and substantial on-chip RAM.
• Advanced communications and networking  High I/O count supports complex interface requirements for networking and infrastructure equipment.
• System prototyping and development  Large programmable resource pool and embedded memory make the device useful for prototyping complex digital systems.

Unique Advantages

• Large programmable fabric: Over 1.31 million logic elements enable implementation of extensive logic and custom architectures on a single device.
• Substantial on-chip memory: Approximately 191 Mbits of embedded RAM reduces dependence on external memory for buffering and data paths.
• High I/O capacity: 832 I/O pins allow integration of multiple high-speed interfaces and dense peripheral connectivity.
• High-pin-count FCBGA package: 2104-FCBGA (47.5 × 47.5 mm) balances pin density and board-level routing for complex designs.
• RoHS compliant: Meets RoHS requirements for restricted substances.
• Extended grade availability: Supplied in an Extended grade offering for applications within the specified temperature range.

Why Choose XCVU5P-L2FLVA2104E?

The XCVU5P-L2FLVA2104E positions itself as a high-capacity Virtex UltraScale+ FPGA option for designs that demand large logic resources, significant embedded memory, and a high number of I/Os in a compact FCBGA package. Its specified operating temperature range and defined core voltage envelope provide clear parameters for system power and thermal planning.

This device is suited to engineering teams and procurement groups targeting dense, programmable logic solutions from AMD's Virtex UltraScale+ family where on-chip resources and I/O density are primary selection criteria.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the XCVU5P-L2FLVA2104E.