XCVU5P-3FLVA2104E

The XCVU5P-3FLVA2104E is a Virtex® UltraScale+™ Field Programmable Gate Array from AMD, offered in a 2104-FCBGA surface-mount package. It delivers very large logic capacity, abundant embedded memory, and a high I/O count suitable for demanding digital designs that require significant on-chip resources.

With over one million logic elements, approximately 191 Mbits of embedded memory and 832 I/O, this device targets high-density logic, large-memory buffering, and extensive interfacing requirements while operating over an extended temperature range.

Key Features

• Core Logic  Approximately 1,313,763 logic elements and 75,072 configurable logic blocks (CLBs) provide substantial programmable fabric for complex digital designs.
• Embedded Memory  Approximately 191 Mbits of on-chip RAM supports large buffers, FIFOs and temporary storage close to logic.
• I/O Capabilities  Up to 832 I/O pins enable extensive external connectivity for multi-channel interfaces and board-level integration.
• Power Supply Range  Designed to operate with a core voltage supply range of 873 mV to 927 mV.
• Package & Mounting  2104-FCBGA (47.5 × 47.5 mm) package case with surface-mount mounting for high-density PCB implementations.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant, meeting common lead-free requirements for board assembly.

Typical Applications

• High-density FPGA compute  Large programmable fabric and abundant embedded memory allow implementation of complex algorithms and acceleration tasks directly in hardware.
• High-performance networking  High I/O count and large on-chip RAM support packet buffering, multi-channel interfacing and protocol processing.
• System prototyping and integration  Extensive logic resources and I/O make the device suitable for integrating multiple functions on a single FPGA for rapid system prototyping.
• Data buffering and memory-intensive tasks  Approximately 191 Mbits of embedded RAM enables local buffering and data staging for throughput-sensitive designs.

Unique Advantages

• Substantial programmable capacity: The large count of logic elements lets you map complex designs and consolidate multiple functions into a single device, reducing board-level complexity.
• Significant on-chip memory: Nearly 191 Mbits of embedded RAM minimizes external memory dependence for temporary storage and high-throughput data paths.
• High I/O density: 832 I/O pins provide flexibility for multi-channel interfaces, extensive sensor arrays, or parallel data lanes without additional interface chips.
• Compact, surface-mount package: The 2104-FCBGA package supports high-density PCB layouts while delivering large resource counts in a single package.
• Designed for extended operation: Extended grade and a 0 °C to 100 °C operating range support deployments in environments requiring wider temperature tolerance.
• Regulatory readiness: RoHS compliance simplifies lead-free assembly and environmental compliance in finished products.

Why Choose XCVU5P-3FLVA2104E?

The XCVU5P-3FLVA2104E positions itself as a high-capacity FPGA solution combining more than one million logic elements, extensive embedded memory and a large I/O complement in a single 2104-FCBGA surface-mount package. This combination delivers integration density and on-chip resources that simplify system architecture for complex digital designs.

Engineers and procurement teams seeking scalable programmable fabric for compute acceleration, networking, or complex system integration will find this AMD Virtex® UltraScale+™ device appropriate where large logic arrays, substantial memory and numerous I/Os are required. Its extended grade and RoHS compliance support reliable operation and assembly in a range of applications.

Request a quote or submit an inquiry to obtain pricing, availability and lead-time information for the XCVU5P-3FLVA2104E.