XCVU7P-1FLVA2104E

The XCVU7P-1FLVA2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC designed for high-density logic and embedded memory integration. It combines a large logic element count, substantial on-chip RAM, and a high I/O count in a 2104-BBGA FCBGA package for compact system-level integration.

Typical use cases include designs that require significant programmable logic capacity, extensive embedded memory, and many external connections, delivered with extended-grade operating limits and RoHS compliance.

Key Features

• Core Logic Capacity — Provides 1,724,100 logic elements to support complex, high-density digital designs.
• Embedded Memory — Approximately 261 Mbits of embedded memory for buffering, data storage, and on-chip memory-intensive functions.
• High I/O Count — 832 I/O pins to accommodate broad peripheral connectivity and multi-channel interfaces.
• Power Supply Range — Operates with a voltage supply range of 825 mV to 876 mV to match platform power designs.
• Package and Mounting — Supplied in a 2104-BBGA, FCBGA package; supplier device package listed as 2104-FCBGA (47.5x47.5). Surface-mount mounting enables compact PCB implementations.
• Operating Grade and Temperature — Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-density logic designs — Use the large logic element capacity for complex FPGA-based processing and control logic implementations.
• Memory-intensive systems — Leverage approximately 261 Mbits of embedded memory for buffering, packet processing, and data handling tasks.
• Connectivity-rich platforms — Employ the 832 I/O pins to support multi-channel interfaces and extensive peripheral integration.

Unique Advantages

• Large programmable fabric: 1,724,100 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 261 Mbits of embedded RAM minimizes dependence on external memory in many designs.
• Extensive I/O availability: 832 I/Os provide flexibility for signal routing and interfacing to diverse peripherals.
• Compact FCBGA packaging: 2104-BBGA/2104-FCBGA packaging supports dense system integration while maintaining surface-mount assembly.
• Extended-grade operation: Rated for 0 °C to 100 °C operation to meet a range of system thermal requirements.
• RoHS compliant: Conforms to RoHS requirements for environmental and regulatory compatibility.

Why Choose XCVU7P-1FLVA2104E?

The XCVU7P-1FLVA2104E positions a high level of programmable logic, large embedded memory, and a high I/O count within a compact 2104 FCBGA package, offering a balanced combination of capacity and integration for demanding FPGA designs. With an extended operating temperature range and RoHS compliance, it serves designs that require robust on-chip resources without sacrificing board-level density.

This device is suited for engineers and procurement teams building systems that benefit from significant on-chip logic and memory resources alongside broad connectivity, enabling scalable implementations and streamlined BOMs.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the XCVU7P-1FLVA2104E.