XCVU7P-2FLVA2104E

IC FPGA 832 I/O 2104FCBGA
Part Description

Virtex UltraScale+ FPGA, XCVU7P, 1,724,000 Logic Cells, 4560 DSP, FLVA2104, Commercial

Quantity 532 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device PackageFLVA2104GradeN/AOperating Temperature0°C – 110°C
Package / Case2104-BGANumber of I/O832Voltage825 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceCompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4Number of LABs/CLBs788160Number of Logic Elements/Cells1724000
Number of GatesN/AECCNEAR99HTS Code8542.31.00.60
QualificationN/ATotal RAM Bits241801626

Overview of XCVU7P-2FLVA2104E – Virtex® UltraScale+™ FPGA, 2104-FCBGA

The XCVU7P-2FLVA2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 2104-FCBGA package. It combines a very large logic fabric with substantial on-chip memory and a wide complement of I/O to support complex, high-density designs.

With approximately 1,724,100 logic elements, roughly 260.8 Mbits of embedded memory and 832 I/O pins, this device is suited to applications that require high integration, significant local data storage, and extensive interfacing within the constraints of an extended-temperature, surface-mount package.

Key Features

  • Logic Capacity  Approximately 1,724,100 logic elements and 98,520 configurable logic blocks (CLBs) to implement large, complex logic designs on a single device.
  • Embedded Memory  Approximately 260.8 Mbits of on-chip RAM to support buffering, FIFOs, and other data-intensive functions without relying solely on external memory.
  • I/O Resources  832 user I/O pins to interface with peripherals, sensors, and other system components.
  • Package and Mounting  2104-FCBGA (47.5 × 47.5 mm) package case (2104-BBGA, FCBGA) with surface-mount mounting for high-density board implementations.
  • Power Supply  Core voltage supply range specified at 825 mV to 876 mV for predictable power planning and delivery.
  • Operating Range and Grade  Extended-grade device with an operating temperature range of 0°C to 100°C.
  • Environmental Compliance  RoHS compliant for regulatory and environmental considerations.

Unique Advantages

  • High integration density: The combination of more than 1.7 million logic elements and nearly 261 Mbits of embedded memory reduces the need for multiple discrete devices.
  • Extensive I/O count: 832 I/O pins provide broad interfacing capability for multi-channel systems and complex board-level connectivity.
  • Compact, manufacturable package: 2104-FCBGA (47.5×47.5 mm) and surface-mount compatibility support compact, production-ready PCB designs.
  • Deterministic power range: A defined core voltage range (825 mV–876 mV) simplifies power-subsystem design and validation.
  • Extended operating range: Rated for 0°C to 100°C operation and designated Extended grade for applications requiring wider temperature capability than commercial-only parts.
  • Regulatory readiness: RoHS compliance eases integration into products with environmental restrictions.

Why Choose XCVU7P-2FLVA2104E?

This Virtex UltraScale+ device delivers a very large logic and memory resource set within a production-ready FCBGA package, making it suitable for designs that need consolidated FPGA capacity and substantial on-chip storage. Its 832 I/O pins and defined power and thermal parameters enable predictable integration into system-level designs.

Choose XCVU7P-2FLVA2104E when your project requires high logic density, significant embedded memory, and a compact surface-mount package with extended-temperature capability—providing scalability and stability within a verified FPGA family.

Request a quote or submit a pricing and availability inquiry for XCVU7P-2FLVA2104E to begin procurement and integration planning.

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