XCVU7P-2FLVA2104E
| Part Description |
Virtex UltraScale+ FPGA, XCVU7P, 1,724,000 Logic Cells, 4560 DSP, FLVA2104, Commercial |
|---|---|
| Quantity | 532 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | FLVA2104 | Grade | N/A | Operating Temperature | 0°C – 110°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2104-BGA | Number of I/O | 832 | Voltage | 825 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 | Number of LABs/CLBs | 788160 | Number of Logic Elements/Cells | 1724000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.00.60 | ||
| Qualification | N/A | Total RAM Bits | 241801626 |
Overview of XCVU7P-2FLVA2104E – Virtex® UltraScale+™ FPGA, 2104-FCBGA
The XCVU7P-2FLVA2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 2104-FCBGA package. It combines a very large logic fabric with substantial on-chip memory and a wide complement of I/O to support complex, high-density designs.
With approximately 1,724,100 logic elements, roughly 260.8 Mbits of embedded memory and 832 I/O pins, this device is suited to applications that require high integration, significant local data storage, and extensive interfacing within the constraints of an extended-temperature, surface-mount package.
Key Features
- Logic Capacity Approximately 1,724,100 logic elements and 98,520 configurable logic blocks (CLBs) to implement large, complex logic designs on a single device.
- Embedded Memory Approximately 260.8 Mbits of on-chip RAM to support buffering, FIFOs, and other data-intensive functions without relying solely on external memory.
- I/O Resources 832 user I/O pins to interface with peripherals, sensors, and other system components.
- Package and Mounting 2104-FCBGA (47.5 × 47.5 mm) package case (2104-BBGA, FCBGA) with surface-mount mounting for high-density board implementations.
- Power Supply Core voltage supply range specified at 825 mV to 876 mV for predictable power planning and delivery.
- Operating Range and Grade Extended-grade device with an operating temperature range of 0°C to 100°C.
- Environmental Compliance RoHS compliant for regulatory and environmental considerations.
Unique Advantages
- High integration density: The combination of more than 1.7 million logic elements and nearly 261 Mbits of embedded memory reduces the need for multiple discrete devices.
- Extensive I/O count: 832 I/O pins provide broad interfacing capability for multi-channel systems and complex board-level connectivity.
- Compact, manufacturable package: 2104-FCBGA (47.5×47.5 mm) and surface-mount compatibility support compact, production-ready PCB designs.
- Deterministic power range: A defined core voltage range (825 mV–876 mV) simplifies power-subsystem design and validation.
- Extended operating range: Rated for 0°C to 100°C operation and designated Extended grade for applications requiring wider temperature capability than commercial-only parts.
- Regulatory readiness: RoHS compliance eases integration into products with environmental restrictions.
Why Choose XCVU7P-2FLVA2104E?
This Virtex UltraScale+ device delivers a very large logic and memory resource set within a production-ready FCBGA package, making it suitable for designs that need consolidated FPGA capacity and substantial on-chip storage. Its 832 I/O pins and defined power and thermal parameters enable predictable integration into system-level designs.
Choose XCVU7P-2FLVA2104E when your project requires high logic density, significant embedded memory, and a compact surface-mount package with extended-temperature capability—providing scalability and stability within a verified FPGA family.
Request a quote or submit a pricing and availability inquiry for XCVU7P-2FLVA2104E to begin procurement and integration planning.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








