XCVU7P-2FLVB2104I

The XCVU7P-2FLVB2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC offering very large on-chip resources in a 2104-BBGA / FCBGA package. It combines a high logic element count, extensive embedded memory, and a large I/O complement in an industrial-grade, surface-mount package.

This device is designed for applications that require significant logic capacity and on-chip storage while operating across an industrial temperature range and a defined low-voltage supply window.

Key Features

• Core Logic 1,724,100 logic elements for implementing large-scale digital designs and complex logic functions.
• Embedded Memory Approximately 261 Mbits of on-chip RAM for local data buffering, state storage, and memory-intensive logic.
• I/O Capacity 702 I/Os to support broad external interface and routing requirements.
• Power Supply Operates from a defined supply range of 825 mV to 876 mV, enabling controlled low-voltage system designs.
• Package & Mounting 2104-BBGA / 2104-FCBGA package (2104-FCBGA (47.5x47.5)); surface-mount mounting type for dense board-level integration.
• Temperature & Grade Industrial grade with an operating range of -40 °C to 100 °C for reliable operation in demanding environments.
• Environmental Compliance RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

• High-density logic systems Leverage the 1,724,100 logic elements to implement complex, large-scale digital architectures on a single device.
• On-chip data buffering Use approximately 261 Mbits of embedded memory for local storage, packet buffering, and dataflow acceleration.
• Multi-interface platforms The 702 I/Os support designs that require many parallel interfaces or extensive external connectivity.

Unique Advantages

• Highly integrated resource set: Combines a very large logic element count and substantial embedded memory to reduce the need for external components.
• Extensive I/O capacity: 702 I/Os enable flexible partitioning of interfaces, simplifying board-level design for complex systems.
• Industrial temperature rating: Rated from -40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact BGA package: 2104-FCBGA packaging provides dense integration suitable for space-constrained PCBs.
• Controlled low-voltage operation: Defined supply range (825 mV–876 mV) allows predictable power design and supply management.
• RoHS compliant: Meets environmental compliance expectations for modern electronic products.

Why Choose XCVU7P-2FLVB2104I?

The XCVU7P-2FLVB2104I positions itself as a high-capacity FPGA solution, delivering a combination of extensive logic resources, substantial embedded memory, and a large I/O count in an industrial-grade surface-mount package. These characteristics make it suitable for engineers and teams designing systems that demand significant on-chip compute and storage within a controlled low-voltage and industrial temperature envelope.

Choosing this device provides design scalability through on-chip resources, board-level integration flexibility via a high I/O count and BGA package, and regulatory alignment with RoHS compliance.

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