XCVU5P-2FLVB2104E

The XCVU5P-2FLVB2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers very high logic capacity and substantial embedded memory in a 2104-ball FCBGA package for surface-mount designs.

With more than one million logic elements, approximately 191 Mbits of on-chip RAM and 702 user I/O pins, this device targets applications that require dense digital integration, large memory buffers and a high I/O count within an extended-grade temperature range.

Key Features

• Logic Capacity  1,313,763 logic elements provide large-scale programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 191 Mbits of embedded memory to support buffering, on-chip data storage and memory-intensive functions.
• I/O Resources  702 user I/O pins enable extensive external interfacing and high pin-count connectivity for multi-channel systems.
• Power Supply  Operates from a core voltage supply range of 825 mV to 876 mV, suitable for the device’s specified power architecture.
• Package & Mounting  2104-FCBGA package (47.5 × 47.5 mm) in a surface-mount form factor for board-level integration requiring high pin density.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for designs targeting commercial and extended-temperature environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Large logic capacity and abundant I/O make this device suitable for complex digital processing and compute-intensive implementations.
• Memory-heavy designs  Approximately 191 Mbits of embedded memory supports on-chip buffering and temporary data storage for streaming or packetized data flows.
• Multi‑channel interface platforms  High I/O count enables aggregation of numerous interfaces and sensors in communications, instrumentation or test equipment.

Unique Advantages

• High logic density: 1,313,763 logic elements reduce the need for multi-chip solutions and simplify board-level integration.
• Substantial on-chip memory: Approximately 191 Mbits of embedded RAM minimizes external memory dependence and improves data-path efficiency.
• Extensive I/O capability: 702 I/O pins enable broad peripheral and interface support without additional bridge devices.
• Compact, high-pin package: 2104-FCBGA (47.5 × 47.5 mm) offers high connectivity in a surface-mount footprint suitable for dense PCBs.
• Extended-grade operation: Rated for 0 °C to 100 °C to address designs requiring a wider-than-commercial temperature range.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XCVU5P-2FLVB2104E?

The XCVU5P-2FLVB2104E combines large-scale programmable logic, significant embedded memory and a very high I/O count in a single 2104-FCBGA surface-mount package. Its extended-grade temperature rating and RoHS compliance make it a practical choice for demanding commercial and extended-temperature applications that require integration of complex digital functions on a single device.

This FPGA is well suited to designers and teams building high-density, memory-intensive systems who need a single-chip solution with ample logic, on-chip RAM and connectivity to simplify board design and reduce component count.

Request a quote or submit an inquiry to obtain pricing and availability for the XCVU5P-2FLVB2104E.