XCVU5P-2FLVA2104E

The XCVU5P-2FLVA2104E is an AMD Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC that delivers a large programmable fabric and significant on-chip memory capacity in a 2104-FCBGA package. Its published silicon resources include 1,313,763 logic elements and approximately 191 Mbits of embedded memory, supporting designs that require dense logic and substantial local RAM.

With 832 I/O pins, a 2104-FCBGA (47.5 × 47.5 mm) package, surface-mount mounting, an extended grade operating range of 0 °C to 100 °C, and a supply voltage window of 825 mV to 876 mV, this device targets applications that need high logic capacity, large embedded memory, and extensive I/O connectivity.

Key Features

• Programmable Logic  Provides 1,313,763 logic elements to implement complex digital designs and large-scale programmable functions.
• Embedded Memory  Approximately 191 Mbits of on-chip RAM (190,976,000 total RAM bits) for buffering, LUT-based storage, and local data storage needs.
• I/O Capacity  832 I/O pins to support dense external connectivity and high pin-count interfaces.
• Package  2104-FCBGA supplier device package (47.5 × 47.5 mm) in a 2104-BBGA, FCBGA case suitable for surface-mount assembly.
• Power  Specified core supply voltage range from 825 mV to 876 mV to match system power-rail requirements.
• Operating Range  Extended grade operation specified from 0 °C to 100 °C for applications within this temperature window.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density digital processing  Large programmable fabric and substantial on-chip memory make the device suitable for designs that implement complex parallel processing or heavy logic workloads.
• Data buffering and local storage  Approximately 191 Mbits of embedded memory supports designs requiring significant on-chip data buffering and intermediate storage.
• High‑pin-count interface designs  832 I/O pins accommodate multiple external interfaces and dense connectivity requirements for systems needing many I/O channels.

Unique Advantages

• High logic capacity: The 1,313,763 logic elements provide the programmable resources needed for large-scale, complex designs without external logic expansion.
• Substantial embedded memory: Approximately 191 Mbits of on-chip RAM reduces dependence on external memory for many buffering and scratchpad needs.
• Extensive I/O: 832 I/O pins enable wide parallel interfaces and multiple peripheral connections directly to the FPGA fabric.
• Compact, high‑density package: The 2104-FCBGA (47.5 × 47.5 mm) package offers high resource density in a surface-mount form factor.
• Extended-grade operation: Specified for 0 °C to 100 °C operation, aligning with systems that operate within this temperature range.
• RoHS compliant: Meets RoHS requirements for restricted substances.

Why Choose XCVU5P-2FLVA2104E?

The XCVU5P-2FLVA2104E combines a large programmable fabric, significant embedded memory, and extensive I/O in a single 2104-FCBGA surface-mount package. Its electrical and environmental specifications—825 mV to 876 mV supply range and 0 °C to 100 °C operating range—make it a clear choice for designs that require concentrated logic resources, local memory capacity, and high pin counts within those constraints.

For engineers and procurement teams building systems that need high logic density, substantial on-chip RAM, and many I/Os in an extended-grade FPGA, this AMD Virtex® UltraScale+™ device provides a documented, specification-driven platform for integration into complex digital designs.

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