XCVU5P-1FLVA2104I

The XCVU5P-1FLVA2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It provides a high count of logic resources, substantial on-chip RAM capacity and a large I/O complement in a 2104-FCBGA package, targeted for designs that require dense programmable logic, embedded memory and extensive external interfacing.

This device is supplied in a 2104-BBGA (2104-FCBGA, 47.5×47.5) surface-mount package, operates over an industrial temperature range, and is RoHS compliant.

Key Features

• Logic Capacity  Approximately 1,313,763 logic elements, providing a large fabric for implementing complex digital functions.
• Configurable Logic Blocks (CLBs)  75,072 CLBs for fine-grained logic structuring and resource partitioning across designs.
• Embedded Memory  Approximately 191 Mbits of embedded memory (190,976,000 total RAM bits) for data buffering, FIFOs and on-chip storage.
• High I/O Density  832 I/O pins to support extensive external connectivity and multi-channel interfaces.
• Power Supply Range  Core operating voltage between 825 mV and 876 mV, enabling designers to match board-level power rails and regulators to device requirements.
• Package and Mounting  2104-FCBGA (47.5×47.5) package in a surface-mount form factor for board-level integration where high pin-count BGA mounting is required.
• Temperature Grade  Industrial operating range from −40 °C to 100 °C for deployment in extended-temperature environments.
• Environmental Compliance  RoHS compliant to meet regulatory requirements for lead-free assembly.

Typical Applications

• Logic‑intensive system functions  Use the large logic element count to consolidate multiple digital functions into a single programmable device.
• Memory‑heavy tasks  Leverage approximately 191 Mbits of on-chip RAM for buffering, packet storage or data staging close to logic.
• I/O‑dense interfacing  Deploy the 832 I/O pins to connect numerous peripherals, high-channel-count front-ends or multi-lane interfaces.

Unique Advantages

• High logic integration: The device’s 1,313,763 logic elements enable consolidation of complex functions that would otherwise require multiple components.
• Substantial on-chip memory: Approximately 191 Mbits of embedded memory reduces external memory needs and simplifies board-level designs.
• Extensive I/O capability: 832 I/O pins support dense external connectivity and flexible interface options without additional interface ICs.
• Industrial temperature support: Rated from −40 °C to 100 °C for deployment in environments requiring extended temperature operation.
• Compact high‑pin package: The 2104-FCBGA (47.5×47.5) package delivers high pin count in a single surface-mount footprint for space-constrained boards.
• Regulatory compliance: RoHS compliant to support lead-free assembly processes and regulatory requirements.

Why Choose XCVU5P-1FLVA2104I?

The XCVU5P-1FLVA2104I positions itself as a high-capacity Virtex® UltraScale+™ FPGA option for designs that demand large programmable logic arrays, significant on-chip RAM and broad external interfacing. Its combination of 1,313,763 logic elements, approximately 191 Mbits of embedded memory and 832 I/O pins makes it suitable for projects that consolidate multiple subsystems into a single programmable device.

Packaged in a 2104-FCBGA and rated for industrial temperature operation, this device is targeted at engineers and teams seeking scalable logic resources and substantial embedded memory in a surface-mount BGA form factor, with RoHS compliance for modern manufacturing processes.

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