XCVU57P-2FSVK2892E

The XCVU57P-2FSVK2892E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD. It delivers high on-chip logic capacity, substantial embedded memory, and a large complement of I/O in a 2892-FCBGA surface-mount package.

Engineered for designs that require large programmable logic resources, significant on-chip RAM and extensive I/O, this device offers a combination of integration and measurable electrical and thermal operating parameters for system-level planning.

Key Features

• Logic Capacity — 2,851,800 logic elements and 162,960 configurable logic blocks (CLBs) to support large-scale programmable logic implementations.
• Embedded Memory — Approximately 74.3 Mbits of on-chip RAM for data buffering, state storage, and algorithm working memory.
• I/O Resources — 624 user I/O pins to interface with multiple peripherals and system-level signals.
• Power Supply — Core voltage supply range of 825 mV to 876 mV for power budgeting and regulator selection.
• Package and Mounting — 2892-BBGA FCBGA package (supplier device package: 2892-FCBGA, 55×55 mm) with surface-mount assembly.
• Operating Range — Extended grade operating temperature from 0 °C to 100 °C for thermal planning.
• Compliance — RoHS compliant for environmental regulation adherence.

Typical Applications

• High-density FPGA designs — Use the device when projects require large programmable logic capacity (2,851,800 logic elements) and extensive CLBs for complex implementations.
• I/O-rich systems — Suitable for systems needing up to 624 I/O pins to connect multiple peripherals, sensors, and external interfaces.
• Memory-intensive functions — Built-in approximately 74.3 Mbits of embedded memory for buffering, look-up tables, and data staging within the FPGA fabric.
• Compact board-level integration — The 2892-FCBGA (55×55 mm) surface-mount package supports high-density board layouts where package footprint and pin count matter.

Unique Advantages

• High programmable logic density: 2,851,800 logic elements provide the capacity to implement large, complex designs without external logic proliferation.
• Substantial on-chip RAM: Approximately 74.3 Mbits of embedded memory reduces dependency on external memory for many buffering and storage functions.
• Extensive connectivity: 624 I/O pins allow broad interfacing options for multi-channel and multi-peripheral systems.
• Compact, high-pin-count package: 2892-FCBGA (55×55 mm) package enables dense interconnects and simplified board-level integration.
• Defined electrical envelope: Core voltage range of 825–876 mV aids precise power-supply design and stability considerations.
• Environmental compliance: RoHS status ensures adherence to common environmental regulations.

Why Choose XCVU57P-2FSVK2892E?

The XCVU57P-2FSVK2892E positions itself as a high-capacity FPGA option within the Virtex® UltraScale+™ family from AMD, combining a large logic element count, significant embedded memory, and abundant I/O in a 2892-FCBGA surface-mount package. Its specified voltage range and extended temperature rating provide clear parameters for system power and thermal design.

This device is suited for design teams and procurement working on complex, high-density programmable logic systems who need verifiable on-chip resources and defined package characteristics. RoHS compliance and AMD manufacture provide supply-chain and environmental information useful for long-term planning.

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