XCVU47P-L2FSVH2892E

The XCVU47P-L2FSVH2892E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, offered in a 2892-ball FCBGA package. It provides very large programmable logic capacity and substantial on-chip memory for designs that require dense logic resources and broad I/O connectivity.

Key device attributes include approximately 2,851,800 logic elements, approximately 74 Mbits of embedded memory, and 624 I/O pins, delivered in an extended-grade, surface-mount 2892-FCBGA (55×55) package.

Key Features

• Core Logic Capacity — Approximately 2,851,800 logic elements and 162,960 CLBs enable large-scale programmable logic implementations.
• Embedded Memory — Approximately 74 Mbits of on-chip RAM (74,344,038 bits) for data buffering and local storage.
• I/O Density — 624 I/O pins to support high-pin-count interfaces and complex board-level connectivity.
• Package & Mounting — 2892-BBGA, FCBGA package; supplier device package 2892-FCBGA (55×55); surface-mount mounting type.
• Power — Core voltage supply range from 698 mV to 742 mV to match system power design constraints.
• Temperature & Grade — Extended-grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density programmable logic systems — Leverage the large logic element count for complex logic and algorithm implementations.
• High-pin-count interface designs — Use the 624 I/O pins for multi-channel or parallel connectivity to peripherals and subsystems.
• Embedded systems with extended temperature needs — Deploy in applications operating within the 0 °C to 100 °C range.
• Board-level production and surface-mount assemblies — 2892-FCBGA (55×55) package supports compact, high-density PCB layouts.

Unique Advantages

• Large programmable capacity: Approximately 2.85 million logic elements allow integration of complex functions on a single device, reducing the need for multiple chips.
• Substantial on-chip memory: Approximately 74 Mbits of embedded RAM minimizes external memory dependence and helps lower board-level routing complexity.
• High I/O count: 624 I/O pins provide flexibility for connecting numerous peripherals and interfaces without additional bridge logic.
• Compact, high-ball-count package: 2892-FCBGA (55×55) delivers high integration density in a surface-mount form factor suitable for production PCBs.
• Extended-grade operation: Rated for 0 °C to 100 °C operation to meet broader embedded system requirements.
• RoHS compliant: Meets common environmental compliance expectations for modern electronics supply chains.

Why Choose XCVU47P-L2FSVH2892E?

The XCVU47P-L2FSVH2892E positions itself as a high-capacity, highly integrated FPGA option within the Virtex® UltraScale+™ family, combining millions of logic elements, tens of megabits of embedded memory, and hundreds of I/O pins in a single, extended-grade FCBGA package. These characteristics make it suitable for designs that consolidate complex digital functions and require dense on-chip resources.

Engineers and purchasers seeking a platform for large-scale programmable logic, dense I/O connectivity, and extended-temperature operation will find this device aligned with those needs while benefiting from the Virtex UltraScale+ product family consistency for design scalability.

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