XCVU45P-L2FSVH2892E

The XCVU45P-L2FSVH2892E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, supplied in a 2892-FCBGA (55×55) package. The device provides a high-capacity programmable fabric with 1,906,800 logic elements, a large amount of embedded memory and a broad I/O count to support complex digital designs.

Its key technical advantages include substantial on-chip memory (approximately 49.6 Mbits), a wide I/O complement (416 pins), and a defined core voltage range (698 mV to 742 mV), enabling dense, integrated implementations where logic capacity and memory bandwidth matter.

Key Features

• Logic Capacity — 1,906,800 logic elements for implementing large-scale programmable logic and complex algorithmic functions.
• Embedded Memory — Approximately 49.6 Mbits of on-chip RAM to support data buffering, large lookup tables, and on-chip data storage.
• I/O Resources — 416 I/O pins to interface with a variety of external peripherals, transceivers, and system components.
• Power — Specified core supply range of 698 mV to 742 mV for the device core power domain.
• Package — 2892-FCBGA / 2892-BBGA packaging in a 55×55 mm footprint for high-density board integration; surface-mount mounting type.
• Operating Range — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital designs — Designs requiring roughly 1.9M logic elements and substantial embedded memory can be implemented on this device.
• Memory‑intensive FPGA functions — Approximately 49.6 Mbits of on-chip RAM supports buffering, lookup tables and intermediate data storage inside the FPGA fabric.
• High‑I/O systems — With 416 I/O pins, the device suits designs that require extensive external interfacing and connectivity.

Unique Advantages

• High logic density: 1,906,800 logic elements enable consolidation of complex logic and multiple functions into a single device.
• Substantial on-chip memory: Approximately 49.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Ample I/O count: 416 I/O pins provide flexibility for system-level integration and broad peripheral connectivity.
• Compact, high-pin-count package: 2892-FCBGA (55×55) delivers high routing density for board-level integration while supporting surface-mount assembly.
• Extended operating range: Rated 0 °C to 100 °C to meet designs requiring extended-grade thermal performance.
• Regulatory compliance: RoHS compliant for environmental and supply-chain requirements.

Why Choose XCVU45P-L2FSVH2892E?

The XCVU45P-L2FSVH2892E combines a large logic element count, significant embedded memory, and a high I/O complement in a compact 2892-FCBGA package to serve designs that demand dense programmable logic and substantial on-chip resources. Its specified core voltage range and extended operating temperature make it suitable for systems where power domain definition and thermal headroom are part of the design constraints.

This device is well suited to teams and projects that need a scalable, high-capacity FPGA platform for consolidating complex digital functions and on-chip memory needs into a single component, while maintaining compliance with RoHS requirements.

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