XCVU45P-2FSVH2892E

The XCVU45P-2FSVH2892E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC by AMD, delivered in a 2892-FCBGA (55×55) package for surface-mount applications. It provides very high logic capacity and substantial on-chip memory in a high-pin-count BGA footprint.

This device targets designs that require large amounts of configurable logic, abundant embedded RAM, and extensive I/O connectivity, while operating within an extended grade temperature range and a narrow core supply window.

Key Features

• Core Logic  Approximately 1,906,800 logic elements organized with 108,960 configurable logic blocks (CLBs) to support large, complex digital designs.
• Embedded Memory  Approximately 49.6 Mbits of on-chip RAM for buffering, packet storage, and intermediate data processing without external memory.
• I/O Capacity  416 dedicated I/O pins to support multiple parallel interfaces and high-pin-count connectivity requirements.
• Power  Core supply specified from 825 mV to 876 mV, enabling integration into low-voltage system power domains.
• Package & Mounting  2892-FCBGA (55×55) package case, surface-mount mounting type, optimized for dense board-level integration.
• Operating Range & Grade  Extended grade device rated for operation from 0 °C to 100 °C to meet a wide range of thermal environments.
• Compliance  RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• High-density digital processing  Use where large amounts of configurable logic and CLBs are required to implement complex datapaths and custom processing engines.
• Memory-intensive functions  Embedded memory (≈49.6 Mbits) supports buffer-heavy tasks such as packet queues, frame buffering, and data staging without relying solely on external RAM.
• High-pin-count interface aggregation  With 416 I/O pins, the device is suitable for designs that consolidate multiple parallel or serial interfaces at the FPGA level.

Unique Advantages

• High integration density: Large logic element count and many CLBs reduce the need for multiple discrete FPGAs or complex external glue logic.
• Substantial on-chip RAM: Approximately 49.6 Mbits of embedded memory minimizes external memory dependency and simplifies board-level BOM.
• Extensive I/O: 416 I/O pins allow consolidation of interfaces and reduce the need for external multiplexing or IO expansion.
• Compact BGA footprint: 2892-FCBGA (55×55) package supports high-density PCB layouts while providing the pin count required for advanced systems.
• Designed for low-voltage cores: Core supply range of 825–876 mV supports integration into low-voltage power architectures.
• RoHS compliant and extended-grade: Meets lead-free assembly requirements and operates across an extended temperature range for broad deployment options.

Why Choose XCVU45P-2FSVH2892E?

The XCVU45P-2FSVH2892E is positioned for designs that demand very high logic capacity, substantial embedded memory, and significant I/O counts within a compact FCBGA package. Its combination of approximately 1.9 million logic elements, nearly 49.6 Mbits of on-chip RAM, and 416 I/O pins provides the integration needed to simplify system architecture and reduce external component count.

Ideal for teams developing large-scale FPGA implementations that require extended-grade operation and a defined low-voltage core supply, this device delivers the attributes necessary for scalable, board-dense designs while remaining RoHS compliant.

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