XCVU45P-L2FSVH2104E

The XCVU45P-L2FSVH2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD, supplied in a 2104-FCBGA package. It combines a large quantity of programmable logic, substantial on-chip memory, and a high I/O count for complex digital designs.

This device is suited to designs that require high logic density, significant embedded memory capacity, and extensive external interfacing. The combination of 108,960 CLBs, approximately 49.6 Mbits of embedded memory, and 416 I/O provides integration capability for demanding system architectures while supporting surface-mount assembly and RoHS compliance.

Key Features

• Core Logic – 108,960 CLBs and 1,906,800 logic elements provide the programmable fabric for implementing complex digital functions and custom logic.
• Embedded Memory – Total on-chip memory of 49,597,645 bits (approximately 49.6 Mbits) for buffering, lookup tables, and data storage within the FPGA fabric.
• I/O Resources – 416 general I/O pins to support multiple interfaces, parallel buses, and extensive signal routing to external components.
• Package and Mounting – Supplied in a 2104-FCBGA package (47.5 × 47.5 mm) / 2104-BBGA FCBGA with surface-mount mounting for board-level integration.
• Power – Specified core voltage range of 698 mV to 742 mV for the device core supply.
• Temperature and Grade – Extended grade device rated for 0 °C to 100 °C operating temperature range.
• Compliance – RoHS compliant for environmental and material considerations.

Typical Applications

• High-density digital implementations – Use the large CLB and logic element count to implement complex state machines, data paths, and custom accelerators.
• Memory-intensive processing – Leverage approximately 49.6 Mbits of embedded memory for buffering, packet processing, and intermediate storage in streaming or packetized data flows.
• Multi-interface aggregation – The 416 I/O pins enable aggregation and bridging of multiple external interfaces, peripheral control, and extensive sensor or actuator connectivity.
• Platform integration – Surface-mount 2104-FCBGA packaging supports integration into compact system boards where high logic and I/O density are required.

Unique Advantages

• Substantial logic capacity: 1,906,800 logic elements allow consolidation of large parts of a system into a single programmable device, reducing board-level component count.
• Significant embedded memory: Approximately 49.6 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O count: 416 I/O pins provide flexibility for multi-channel interfaces and parallel connectivity without requiring additional I/O expanders.
• Compact, assembly-ready package: 2104-FCBGA (47.5 × 47.5 mm) surface-mount package enables dense board layouts and standard assembly processes.
• Extended operating range and RoHS compliance: Extended grade (0 °C to 100 °C) and RoHS compliance support environmental and regulatory requirements for many electronic systems.

Why Choose XCVU45P-L2FSVH2104E?

The XCVU45P-L2FSVH2104E positions itself as a high-capacity FPGA option within the Virtex® UltraScale+™ family, delivering a combination of large programmable logic, substantial embedded memory, and extensive I/O in a single 2104-FCBGA package. Its extended-grade thermal range and RoHS compliance make it suitable for applications that need reliable operation and regulatory conformance.

This device is ideal for designs that benefit from consolidation of complex digital functions into a single programmable component—reducing BOM complexity and enabling compact system architectures while preserving flexibility through field programmability.

Request a quote or submit a sales inquiry for pricing and availability of the XCVU45P-L2FSVH2104E. Our team can provide lead-time, ordering information, and support for integrating this FPGA into your designs.