XCVU45P-2FSVH2104E
| Part Description |
Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 416 49597645 1906800 2104-BBGA, FCBGA |
|---|---|
| Quantity | 561 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2104-FCBGA (47.5x47.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2104-BBGA, FCBGA | Number of I/O | 416 | Voltage | 825 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 108960 | Number of Logic Elements/Cells | 1906800 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49597645 |
Overview of XCVU45P-2FSVH2104E – Virtex® UltraScale+™ FPGA, 2104-BBGA
The XCVU45P-2FSVH2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 2104-BBGA FCBGA package. It delivers a high logic capacity and substantial on-chip memory in a surface-mount 2104-FCBGA (47.5×47.5 mm) package for systems that require dense programmable logic, abundant I/O and extended-grade thermal performance.
Targeted at designs that need high integration and flexibility, this device combines 1,906,800 logic elements, approximately 49.6 Mbits of embedded memory and 416 I/O to support complex, high-density implementations while operating within an extended 0 °C to 100 °C range and a nominal supply window of 825 mV to 876 mV.
Key Features
- Core Logic 1,906,800 logic elements to implement large-scale digital designs and complex programmable logic.
- Logic Blocks 108,960 configurable logic blocks (reported block count) to structure and partition designs effectively.
- Embedded Memory Approximately 49.6 Mbits of on-chip RAM for buffering, lookup tables and data storage close to logic.
- I/O 416 user I/O pins to accommodate wide parallel interfaces and multiple high-density peripheral connections.
- Package 2104-BBGA, FCBGA package with supplier device package 2104-FCBGA (47.5×47.5 mm) for compact, high-pin-count board integration.
- Power Operates from a supply range of 825 mV to 876 mV to match platform power distribution and sequencing requirements.
- Thermal and Grade Extended-grade device rated for operation from 0 °C to 100 °C for applications requiring above-commercial thermal range.
- Mounting and Compliance Surface mount package construction and RoHS compliance for modern PCB assembly and regulatory requirements.
Typical Applications
- Telecommunications and Network Equipment Use the 416 I/O and large logic capacity to implement protocol processing, packet handling and interface aggregation in network line cards and switches.
- Data Processing and Acceleration Deploy the abundant logic elements and roughly 49.6 Mbits of embedded memory for on-chip buffering and custom compute pipelines in acceleration appliances.
- High-density FPGA-based Systems Leverage the high pin count and 2104-FCBGA package to consolidate multiple functions on a single programmable device in compact, board-level designs.
Unique Advantages
- High logic density: 1,906,800 logic elements enable large finite-state machines, deep pipelining and complex control/data paths without partitioning across multiple FPGAs.
- Substantial embedded memory: Approximately 49.6 Mbits of on-chip RAM reduces dependence on external memory for many buffering and LUT storage needs, simplifying BOM and board routing.
- Generous I/O resources: 416 I/O pins support wide parallel interfaces and multiple peripheral domains, easing interface design and integration.
- Compact high-pin-count package: 2104-FCBGA (47.5×47.5 mm) provides the pin density required for advanced system implementations while remaining surface-mount compatible.
- Extended-grade thermal range: Rated for 0 °C to 100 °C operation to meet elevated thermal requirements without forcing a larger thermal management redesign.
- RoHS compliant: RoHS status supports regulatory compliance and environmental considerations for modern electronics manufacturing.
Why Choose XCVU45P-2FSVH2104E?
The XCVU45P-2FSVH2104E positions itself as a high-capacity Virtex® UltraScale+™ FPGA option for designs that demand large programmable logic resources, significant embedded memory and a high I/O count in a single-package solution. Its 1,906,800 logic elements, approximately 49.6 Mbits of on-chip RAM and 416 I/O make it suitable for consolidating complex digital functions while the 2104-FCBGA package supports dense board-level integration.
With an extended 0 °C to 100 °C operating range, a defined supply window of 825 mV to 876 mV and RoHS compliance, this device offers a balance of performance, integration and compliance for engineering teams designing advanced, high-density systems where long-term scalability and platform consolidation matter.
Request a quote or submit an inquiry to receive pricing and availability for XCVU45P-2FSVH2104E and to discuss how this FPGA can fit your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








