XCVU45P-2FSVH2104E

IC FPGA 416 I/O 2104FCBGA
Part Description

Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 416 49597645 1906800 2104-BBGA, FCBGA

Quantity 561 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package2104-FCBGA (47.5x47.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2104-BBGA, FCBGANumber of I/O416Voltage825 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs108960Number of Logic Elements/Cells1906800
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49597645

Overview of XCVU45P-2FSVH2104E – Virtex® UltraScale+™ FPGA, 2104-BBGA

The XCVU45P-2FSVH2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 2104-BBGA FCBGA package. It delivers a high logic capacity and substantial on-chip memory in a surface-mount 2104-FCBGA (47.5×47.5 mm) package for systems that require dense programmable logic, abundant I/O and extended-grade thermal performance.

Targeted at designs that need high integration and flexibility, this device combines 1,906,800 logic elements, approximately 49.6 Mbits of embedded memory and 416 I/O to support complex, high-density implementations while operating within an extended 0 °C to 100 °C range and a nominal supply window of 825 mV to 876 mV.

Key Features

  • Core Logic  1,906,800 logic elements to implement large-scale digital designs and complex programmable logic.
  • Logic Blocks  108,960 configurable logic blocks (reported block count) to structure and partition designs effectively.
  • Embedded Memory  Approximately 49.6 Mbits of on-chip RAM for buffering, lookup tables and data storage close to logic.
  • I/O  416 user I/O pins to accommodate wide parallel interfaces and multiple high-density peripheral connections.
  • Package  2104-BBGA, FCBGA package with supplier device package 2104-FCBGA (47.5×47.5 mm) for compact, high-pin-count board integration.
  • Power  Operates from a supply range of 825 mV to 876 mV to match platform power distribution and sequencing requirements.
  • Thermal and Grade  Extended-grade device rated for operation from 0 °C to 100 °C for applications requiring above-commercial thermal range.
  • Mounting and Compliance  Surface mount package construction and RoHS compliance for modern PCB assembly and regulatory requirements.

Typical Applications

  • Telecommunications and Network Equipment  Use the 416 I/O and large logic capacity to implement protocol processing, packet handling and interface aggregation in network line cards and switches.
  • Data Processing and Acceleration  Deploy the abundant logic elements and roughly 49.6 Mbits of embedded memory for on-chip buffering and custom compute pipelines in acceleration appliances.
  • High-density FPGA-based Systems  Leverage the high pin count and 2104-FCBGA package to consolidate multiple functions on a single programmable device in compact, board-level designs.

Unique Advantages

  • High logic density: 1,906,800 logic elements enable large finite-state machines, deep pipelining and complex control/data paths without partitioning across multiple FPGAs.
  • Substantial embedded memory: Approximately 49.6 Mbits of on-chip RAM reduces dependence on external memory for many buffering and LUT storage needs, simplifying BOM and board routing.
  • Generous I/O resources: 416 I/O pins support wide parallel interfaces and multiple peripheral domains, easing interface design and integration.
  • Compact high-pin-count package: 2104-FCBGA (47.5×47.5 mm) provides the pin density required for advanced system implementations while remaining surface-mount compatible.
  • Extended-grade thermal range: Rated for 0 °C to 100 °C operation to meet elevated thermal requirements without forcing a larger thermal management redesign.
  • RoHS compliant: RoHS status supports regulatory compliance and environmental considerations for modern electronics manufacturing.

Why Choose XCVU45P-2FSVH2104E?

The XCVU45P-2FSVH2104E positions itself as a high-capacity Virtex® UltraScale+™ FPGA option for designs that demand large programmable logic resources, significant embedded memory and a high I/O count in a single-package solution. Its 1,906,800 logic elements, approximately 49.6 Mbits of on-chip RAM and 416 I/O make it suitable for consolidating complex digital functions while the 2104-FCBGA package supports dense board-level integration.

With an extended 0 °C to 100 °C operating range, a defined supply window of 825 mV to 876 mV and RoHS compliance, this device offers a balance of performance, integration and compliance for engineering teams designing advanced, high-density systems where long-term scalability and platform consolidation matter.

Request a quote or submit an inquiry to receive pricing and availability for XCVU45P-2FSVH2104E and to discuss how this FPGA can fit your next design.

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