XCVU45P-1FSVH2892E

The XCVU45P-1FSVH2892E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC provided in a 2892-ball FCBGA package. It delivers large on-chip resources, including 1,906,800 logic elements and approximately 49.6 Mbits of embedded RAM, for designs that require significant programmable logic and memory integration.

Supplied in a 2892-FCBGA (55×55) surface-mount package, this FPGA is specified for an extended operating temperature range of 0 °C to 100 °C and operates from an 825 mV to 876 mV core voltage supply. It is RoHS compliant.

Key Features

• Logic Capacity 1,906,800 logic elements to support complex programmable logic implementations.
• Embedded Memory Approximately 49.6 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive logic.
• I/O Count 416 I/O pins to accommodate multiple high-density interfaces and external peripherals.
• Package & Mounting 2892-ball FCBGA package (2892-BBGA, supplier device package 2892-FCBGA, 55×55) in a surface-mount format for board-level integration.
• Power Core voltage supply range 825 mV to 876 mV for defined power domain planning.
• Temperature & Grade Extended grade with an operating temperature range of 0 °C to 100 °C for systems requiring wider-than-commercial thermal tolerance.
• Environmental Compliance RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assemblies.

Typical Applications

• High-capacity logic systems Implement large-scale programmable logic where millions of logic elements are required.
• Memory-intensive designs Use embedded RAM for buffering, packet processing, or state machines that need on-chip storage.
• High-pin-count interfaces Leverage 416 I/Os to connect multiple peripherals, interfaces, or high-speed front-end circuitry.
• Board-level integrated solutions Deploy in surface-mount, high-density PCB designs using the 2892-FCBGA (55×55) package.

Unique Advantages

• Large programmable fabric: 1,906,800 logic elements enable complex logic and system integration on a single device.
• Substantial on-chip memory: Approximately 49.6 Mbits of RAM reduces dependence on external memory for many use cases.
• High I/O capacity: 416 I/Os provide flexibility for multi-channel or multi-protocol designs.
• Compact, manufacturable package: 2892-FCBGA (55×55) ball grid array supports surface-mount assembly in compact layouts.
• Defined power domain: Core voltage range of 825 mV–876 mV assists in power budgeting and supply design.
• Extended operating range: 0 °C to 100 °C operating temperature rating for applications requiring wider thermal tolerance than typical commercial parts.

Why Choose XCVU45P-1FSVH2892E?

The XCVU45P-1FSVH2892E positions itself as a high-capacity FPGA option within the Virtex UltraScale+ family, providing a combination of large logic resources, significant embedded memory, and a high I/O count in a 2892-ball FCBGA package. Its electrical and thermal specifications support integration into designs that need defined power domains and extended operating temperatures.

This device is suited for customers and designs that require consolidated programmable logic and on-chip memory at scale, along with a compact surface-mount footprint and RoHS compliance for modern manufacturing processes.

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