XCVU440-2FLGA2892I
| Part Description |
Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC 1456 90726400 5540850 2892-BBGA, FCBGA |
|---|---|
| Quantity | 209 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2892-FCBGA (55x55) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2892-BBGA, FCBGA | Number of I/O | 1456 | Voltage | 922 mV - 979 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 316620 | Number of Logic Elements/Cells | 5540850 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 90726400 |
Overview of XCVU440-2FLGA2892I – Virtex® UltraScale™ FPGA, 2892-FCBGA
The XCVU440-2FLGA2892I is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD supplied in a 2892-FCBGA (55×55) package for surface-mount applications. This industrial-grade device delivers very high logic density and substantial embedded memory capacity for designs that require intensive on-chip resources and high I/O counts.
Key measurable attributes include 5,540,850 logic elements, approximately 90.7 Mbits of embedded RAM, 1,456 I/Os, a nominal supply range of 922 mV to 979 mV, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.
Key Features
- Core Logic 5,540,850 logic elements provide a very high-density programmable fabric for complex digital functions and large custom logic implementations.
- Embedded Memory Approximately 90.7 Mbits of on-chip RAM to support memory-intensive algorithms and buffering without reliance on external memory for many use cases.
- I/O Capacity 1,456 available I/O pins to accommodate high-pin-count interfaces and extensive peripheral connectivity on a single device.
- Power Operates within a supply voltage window of 922 mV to 979 mV, enabling predictable power design within that defined range.
- Package & Mounting 2892-FCBGA package (55×55) in a surface-mount form factor suitable for board-level assembly and compact system integration.
- Temperature & Grade Industrial-grade qualification with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant to support lead-free manufacturing processes and regulatory preferences.
Typical Applications
- High-density digital processing — Implements large-scale custom logic and signal processing functions using the device's multi-million logic-element capacity.
- Memory-intensive FPGA designs — Leverages approximately 90.7 Mbits of embedded RAM for buffering, lookup tables, and on-chip data storage.
- High-pin-count interface systems — Uses 1,456 I/Os to integrate multiple peripherals, sensors, or external interfaces directly to the FPGA.
- Industrial control and instrumentation — Industrial-grade rating and −40 °C to 100 °C operating range suit demanding industrial environments requiring robust operation.
Unique Advantages
- High logic density: 5,540,850 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
- Substantial on-chip memory: Approximately 90.7 Mbits of embedded RAM decreases dependence on external memory for many workloads, simplifying board design.
- Extensive I/O: 1,456 I/Os support broad system integration and flexible interface mapping without additional bridging components.
- Industrial temperature range: −40 °C to 100 °C and industrial grade designation support reliable operation in harsh environments.
- Compact, high-pin-count package: 2892-FCBGA (55×55) surface-mount package offers a balance of integration density and board space efficiency.
- Regulatory readiness: RoHS compliance aligns with lead-free manufacturing requirements.
Why Choose XCVU440-2FLGA2892I?
The XCVU440-2FLGA2892I positions itself for designs that demand very high programmable logic capacity, substantial embedded memory, and large I/O resources in an industrial-grade FPGA. Its combination of 5.54 million logic elements, roughly 90.7 Mbits of on-chip RAM, and 1,456 I/Os allows system designers to integrate extensive functionality on a single silicon device, simplifying BOM and board-level complexity.
This device is suited to teams developing high-density, memory- and I/O-intensive designs that require robust environmental performance. Its package, power window, and RoHS compliance provide a clear set of engineering parameters for system integration, long-term deployment, and manufacturability.
Request a quote or submit a purchase inquiry to evaluate XCVU440-2FLGA2892I for your next high-density FPGA design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








