XCVU440-2FLGA2892I

IC FPGA 1456 I/O 2892FCBGA
Part Description

Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC 1456 90726400 5540850 2892-BBGA, FCBGA

Quantity 209 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package2892-FCBGA (55x55)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2892-BBGA, FCBGANumber of I/O1456Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs316620Number of Logic Elements/Cells5540850
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits90726400

Overview of XCVU440-2FLGA2892I – Virtex® UltraScale™ FPGA, 2892-FCBGA

The XCVU440-2FLGA2892I is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD supplied in a 2892-FCBGA (55×55) package for surface-mount applications. This industrial-grade device delivers very high logic density and substantial embedded memory capacity for designs that require intensive on-chip resources and high I/O counts.

Key measurable attributes include 5,540,850 logic elements, approximately 90.7 Mbits of embedded RAM, 1,456 I/Os, a nominal supply range of 922 mV to 979 mV, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

  • Core Logic 5,540,850 logic elements provide a very high-density programmable fabric for complex digital functions and large custom logic implementations.
  • Embedded Memory Approximately 90.7 Mbits of on-chip RAM to support memory-intensive algorithms and buffering without reliance on external memory for many use cases.
  • I/O Capacity 1,456 available I/O pins to accommodate high-pin-count interfaces and extensive peripheral connectivity on a single device.
  • Power Operates within a supply voltage window of 922 mV to 979 mV, enabling predictable power design within that defined range.
  • Package & Mounting 2892-FCBGA package (55×55) in a surface-mount form factor suitable for board-level assembly and compact system integration.
  • Temperature & Grade Industrial-grade qualification with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Environmental Compliance RoHS compliant to support lead-free manufacturing processes and regulatory preferences.

Typical Applications

  • High-density digital processing — Implements large-scale custom logic and signal processing functions using the device's multi-million logic-element capacity.
  • Memory-intensive FPGA designs — Leverages approximately 90.7 Mbits of embedded RAM for buffering, lookup tables, and on-chip data storage.
  • High-pin-count interface systems — Uses 1,456 I/Os to integrate multiple peripherals, sensors, or external interfaces directly to the FPGA.
  • Industrial control and instrumentation — Industrial-grade rating and −40 °C to 100 °C operating range suit demanding industrial environments requiring robust operation.

Unique Advantages

  • High logic density: 5,540,850 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
  • Substantial on-chip memory: Approximately 90.7 Mbits of embedded RAM decreases dependence on external memory for many workloads, simplifying board design.
  • Extensive I/O: 1,456 I/Os support broad system integration and flexible interface mapping without additional bridging components.
  • Industrial temperature range: −40 °C to 100 °C and industrial grade designation support reliable operation in harsh environments.
  • Compact, high-pin-count package: 2892-FCBGA (55×55) surface-mount package offers a balance of integration density and board space efficiency.
  • Regulatory readiness: RoHS compliance aligns with lead-free manufacturing requirements.

Why Choose XCVU440-2FLGA2892I?

The XCVU440-2FLGA2892I positions itself for designs that demand very high programmable logic capacity, substantial embedded memory, and large I/O resources in an industrial-grade FPGA. Its combination of 5.54 million logic elements, roughly 90.7 Mbits of on-chip RAM, and 1,456 I/Os allows system designers to integrate extensive functionality on a single silicon device, simplifying BOM and board-level complexity.

This device is suited to teams developing high-density, memory- and I/O-intensive designs that require robust environmental performance. Its package, power window, and RoHS compliance provide a clear set of engineering parameters for system integration, long-term deployment, and manufacturability.

Request a quote or submit a purchase inquiry to evaluate XCVU440-2FLGA2892I for your next high-density FPGA design.

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