XCVU440-2FLGA2892E

The XCVU440-2FLGA2892E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) in a 2892-ball FCBGA package. It delivers a high-density programmable fabric with a large logic element count, substantial on-chip memory, and a high I/O count for system designs that require extensive integration at the chip level.

Key attributes include approximately 5,540,850 logic elements, roughly 90.7 Mbits of embedded memory, and 1,456 I/O pins, making the device suitable for designs that demand large amounts of logic resources, significant embedded RAM, and broad I/O connectivity within a 55×55 mm FCBGA footprint.

Key Features

• Logic Capacity  Approximately 5,540,850 logic elements to implement large-scale digital designs and complex programmable logic functions.
• Embedded Memory  Approximately 90.7 Mbits of on-chip RAM to support buffering, large lookup tables, and data storage for high-throughput designs.
• High I/O Count  1,456 programmable I/O pins provide extensive external connectivity for multi-channel interfaces and board-level integration.
• Package and Mounting  2892-BBGA / 2892-FCBGA (55×55 mm) surface-mount package for dense board designs where a high-ball-count BGA is required.
• Supply Voltage Range  Operates from 922 mV to 979 mV, enabling designers to plan power delivery and regulator selection precisely around the specified core supply window.
• Operating Temperature  Rated for operation from 0 °C to 100 °C (Extended grade), allowing deployment in controlled and industrial-adjacent ambient conditions.
• Mounting Type  Surface mount package supports standard PCB assembly processes for BGA components.

Typical Applications

• High-density digital systems  Implement large-scale custom logic and algorithm acceleration where extensive logic elements and on-chip RAM are required.
• Multi‑channel I/O platforms  Use the 1,456 I/O pins to connect numerous interfaces, sensors, or transceivers in data aggregation and signal-routing applications.
• FPGA-based processing modules  Deploy as the programmable compute element in modules that need significant embedded memory for buffering and intermediate data storage.
• Board-level integration  Leverage the 2892-FCBGA (55×55) package for high-density PCB designs that consolidate multiple functions onto a single FPGA.

Unique Advantages

• Large programmable fabric: A high logic element count enables integration of complex algorithms and multiple subsystems on a single device, reducing component count.
• Substantial on-chip RAM: Approximately 90.7 Mbits of embedded memory simplifies data path design and lowers external memory dependency for many workloads.
• Extensive I/O availability: 1,456 I/Os provide flexibility to interface with numerous peripherals and parallel data channels without external multiplexing.
• Compact high-ball-count package: The 2892-FCBGA (55×55) package provides a dense pinout that supports complex routing and high-pin-count designs in a single footprint.
• Defined supply and thermal envelope: Clear voltage supply range (922 mV–979 mV) and operating temperature (0 °C–100 °C) allow precise system-level power and thermal planning.

Why Choose XCVU440-2FLGA2892E?

The XCVU440-2FLGA2892E positions itself as a high-density Virtex UltraScale FPGA option for projects that require extensive logic resources, significant embedded memory, and broad I/O capability within an FCBGA package. Its combination of approximately 5.54 million logic elements, roughly 90.7 Mbits of on-chip RAM, and 1,456 I/Os supports consolidation of complex functions into a single programmable device.

This device is suitable for engineering teams and procurement organizations targeting designs that benefit from high integration density and predictable power/thermal parameters. The extended-grade temperature rating and clearly specified package and supply characteristics help with system validation and deployment planning.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time details for the XCVU440-2FLGA2892E. Our team can assist with order placement and provide component-level information to support your design and procurement process.