XCVU3P-3FFVC1517E

The XCVU3P-3FFVC1517E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 1517-FCBGA package, offered in an Extended grade. It provides a combination of high logic capacity, substantial on-chip memory, and a large I/O complement for designs that require dense programmable logic and extensive interfacing.

Suitable for applications that need significant embedded memory, many I/O signals, and a surface-mount FCBGA package, this device targets engineers seeking high integration and measurable electrical and thermal operating ranges.

Key Features

• Logic Capacity  Provides 49,260 configurable logic blocks (CLBs) delivering 862,050 logic elements for complex digital designs and high-density logic implementations.
• Embedded Memory  Approximately 118 Mbits of on-chip RAM to support large buffers, data staging, and memory-intensive logic functions.
• I/O Count  520 user I/Os to support extensive external interfacing and high-pin-count board designs.
• Package  1517-FCBGA (40×40) supplier device package; package case listed as 1517-BBGA, FCBGA for surface-mount applications.
• Power Supply Range  Core supply operating range from 873 mV to 927 mV to match system-level power design constraints.
• Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for applications that require wider-than-commercial thermal performance.
• Mounting  Surface-mount device optimized for modern PCB assembly processes.
• RoHS Compliance  RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• High-density digital processing  Large logic capacity and substantial embedded RAM enable implementation of complex programmable data paths and custom accelerators.
• High I/O interface systems  520 I/Os allow aggregation and bridging of multiple external interfaces and high-pin-count peripheral connectivity.
• Memory-intensive buffering  Approximately 118 Mbits of on-chip RAM supports sizable buffers for packet handling, streaming data, and intermediate processing.
• Board-level integration  Surface-mount 1517-FCBGA packaging facilitates compact, high-density PCB layouts for systems requiring large FPGA integration.

Unique Advantages

• High logic density: 862,050 logic elements enable next-level integration of complex logic functions into a single FPGA, reducing external component count.
• Substantial embedded memory: Approximately 118 Mbits of RAM help minimize external memory dependency and simplify memory subsystem design.
• Extensive I/O capability: 520 user I/Os provide flexible interfacing options, making the device suitable for multi-channel and mixed-signal front-end systems.
• Compact FCBGA package: The 1517-FCBGA (40×40) package supports high-density board designs while maintaining a surface-mount profile for automated assembly.
• Defined electrical and thermal windows: Specified supply range (873 mV–927 mV) and operating temperature (0 °C–100 °C) allow precise system power and thermal planning.
• Extended grade and RoHS compliance: Offers a higher-level grade and environmental compliance to align with long-term deployment and regulatory expectations.

Why Choose XCVU3P-3FFVC1517E?

The XCVU3P-3FFVC1517E positions itself as a highly integrated FPGA option within the Virtex® UltraScale+™ family, combining substantial logic resources, large on-chip memory, and a high I/O count in a 1517-FCBGA surface-mount package. Its extended-grade rating and defined supply and temperature ranges make it suitable for demanding board-level designs that require predictable electrical and thermal margins.

This device is appropriate for design teams focused on consolidating complex logic, reducing external memory dependence, and implementing dense I/O subsystems. Its specifications support scalability and robustness for medium- to high-complexity programmable logic projects backed by the Virtex UltraScale+ product lineage.

Request a quote or submit an inquiry to get pricing and availability for the XCVU3P-3FFVC1517E and discuss how it fits your next design.