XCVU3P-1FFVC1517E

The XCVU3P-1FFVC1517E is a Virtex® UltraScale+™ field programmable gate array (FPGA) optimized for designs that require very large logic capacity, substantial embedded memory, and a high pin count. It is supplied in a 1517-FCBGA (40×40) surface-mount package and is intended for system-level integration where dense programmable logic and abundant I/O are required.

With 862,050 logic elements and approximately 130.4 Mbits of embedded memory, this extended-grade device supports complex digital designs while operating within a low-voltage supply range of 0.825 V to 0.876 V and an operating temperature range of 0 °C to 100 °C.

Key Features

• Large logic capacity — 862,050 logic elements to support complex, high-density digital designs and extensive custom logic implementation.
• Substantial embedded memory — Approximately 130.4 Mbits of on-chip RAM for buffering, lookup tables, and data processing local to the FPGA fabric.
• High I/O count — 520 user I/O pins to enable broad connectivity options for board-level interfaces and multi-channel systems.
• Package and mounting — 1517-BBGA / 1517-FCBGA (40×40) surface-mount package that supports compact board layouts and high-density integration.
• Power supply — Low-voltage core supply range of 0.825 V to 0.876 V to align with modern power-optimized designs.
• Operating range and grade — Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance for environmental conformity.

Typical Applications

• High-density digital systems — Implements large-scale custom logic and control functions where high logic cell counts and embedded memory are needed.
• Signal processing platforms — Local embedded RAM and abundant logic support buffering, filtering, and parallel data operations in DSP applications.
• Multi-interface controllers — High I/O count enables integration of multiple board-level interfaces, sensors, and peripherals in a single FPGA.

Unique Advantages

• Large programmable fabric: 862,050 logic elements offer the headroom to implement complex finite-state machines, pipelines, and custom accelerators without partitioning across multiple devices.
• Significant on-chip memory: Approximately 130.4 Mbits of embedded RAM reduces external memory dependence and supports high-throughput local buffering.
• High I/O density: 520 I/O pins provide flexibility for multi-channel and multi-interface designs, simplifying board-level connectivity.
• Compact surface-mount packaging: 1517-FCBGA (40×40) package enables dense PCB layouts and system-level integration in space-constrained applications.
• Energy-efficient core operation: Core voltage range of 0.825 V to 0.876 V supports designs targeting lower power consumption in the programmable fabric.
• Extended-grade reliability: Rated for 0 °C to 100 °C operation and RoHS compliant for deployment in standard commercial and extended-temperature environments.

Why Choose XCVU3P-1FFVC1517E?

The XCVU3P-1FFVC1517E combines a very large logic element count with substantial embedded memory and a high I/O complement in a compact FCBGA package, delivering a balanced platform for complex digital designs. Its low-voltage core operation and extended-grade temperature range make it suitable for systems that demand both density and predictable operating characteristics.

This device is well suited to engineering teams building high-density, board-level FPGA solutions that require on-chip memory, extensive logic resources, and flexible I/O. Choosing this part supports scalable designs with a focus on integration, memory locality, and reliable operation within the specified voltage and temperature limits.

Request a quote or submit an inquiry to receive pricing and availability for the XCVU3P-1FFVC1517E and to discuss how it can meet your design requirements.