XCVU37P-L2FSVH2892E

The XCVU37P-L2FSVH2892E is a Virtex® UltraScale+™ FPGA offering a high density of programmable logic and on-chip memory in a 2892-FCBGA (55×55) surface-mount package. It provides approximately 2.85 million logic elements and approximately 74 Mbits of embedded memory, making it suitable for designs that require large amounts of configurable logic and memory resources.

With 624 I/O, an extended-grade temperature rating (0 °C to 100 °C), and a core voltage supply range of 698 mV to 742 mV, this device targets applications that need high integration and significant I/O capacity within a single FPGA package.

Key Features

• Programmable Logic Density  Approximately 2,851,800 logic elements provide extensive resources for complex, compute-heavy designs and large-scale programmable functions.
• Embedded Memory  Approximately 74 Mbits of on-chip RAM enables memory-intensive logic implementations and reduces the need for external memory components.
• I/O Capacity  624 I/O pins support substantial external interfacing for multi-channel data paths and complex system integration.
• Package and Mounting  2892-FCBGA (55×55) package in a surface-mount format delivers a high-pin-count solution for dense board designs.
• Power Supply Range  Core voltage supply specified between 698 mV and 742 mV to match system power-rail requirements.
• Operating Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for applications requiring broader temperature tolerance than commercial grade.
• RoHS Compliant  Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• High-density programmable logic systems  Deploys the device's ~2.85M logic elements where large-scale logic implementation and parallel processing are required.
• Memory-intensive designs  Leverages approximately 74 Mbits of embedded memory to support complex buffering, look-up tables, and data processing on-chip.
• I/O-rich system integration  Uses 624 I/O pins to interface with multiple peripherals, sensors, or multi-lane data streams without immediate reliance on external I/O expanders.

Unique Advantages

• High integration density: Large logic element and embedded memory counts reduce the need for multiple discrete components and simplify board-level architecture.
• Substantial I/O availability: 624 I/O pins enable complex interfacing and broad system connectivity from a single FPGA package.
• Compact, high-pin-count package: 2892-FCBGA (55×55) provides a compact footprint while supporting extensive pinout and signal routing.
• Extended temperature rating: Rated 0 °C to 100 °C to support applications that require a wider operating range than standard commercial-grade devices.
• RoHS compliance: Aligns with environmental regulatory requirements for assembly and deployment.

Why Choose XCVU37P-L2FSVH2892E?

The XCVU37P-L2FSVH2892E is positioned for designs that demand substantial programmable logic, significant on-chip memory, and extensive I/O in a single, surface-mount FCBGA package. Its combination of approximately 2.85 million logic elements, approximately 74 Mbits of embedded RAM, and 624 I/O makes it well suited to integrated systems where consolidation and on-board capability are priorities.

Customers building scalable, high-density FPGA-based systems will find long-term value in the device’s integration level, extended operating range, and RoHS compliance—enabling concise BOMs and simplified board designs while accommodating demanding logic and memory requirements.

Request a quote or submit an inquiry to discuss availability, pricing, and how the XCVU37P-L2FSVH2892E can fit your design requirements.