XCVU3P-2FFVC1517E

The XCVU3P-2FFVC1517E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD offered in a 1517-FCBGA package. It provides substantial programmable logic capacity, a large on-chip memory footprint and a high I/O count for designs that require dense logic integration and significant embedded RAM.

Key device parameters include 862,050 logic elements, approximately 130 Mbits of embedded memory, 520 I/O pins, an extended-grade operating range, and a low-voltage core supply range from 825 mV to 876 mV.

Key Features

• Core Logic: 862,050 logic elements provide extensive programmable resources for complex digital designs and logic-intensive functions.
• Embedded Memory: Approximately 130 Mbits of on-chip RAM supports large buffers, FIFOs, and memory-intensive processing without external memory dependency.
• I/O Capability: 520 user I/O pins enable high port counts and broad connectivity options for interfacing to peripherals and subsystems.
• Power Supply: Core voltage operation specified from 825 mV to 876 mV for compatibility with low-voltage power architectures.
• Package and Mounting: Supplied in a 1517-BBGA (1517-FCBGA, 40×40) surface-mount package suitable for compact board-level integration.
• Operating Range: Extended-grade temperature specification from 0 °C to 100 °C for deployment in controlled and industrial-adjacent environments.
• RoHS Compliant: Conforms to RoHS regulations for environmentally compliant assembly designs.

Typical Applications

• High-density logic implementations: Use the large logic element count to implement complex custom processing, protocol stacks, and acceleration engines directly in programmable logic.
• Memory-centric designs: Leverage approximately 130 Mbits of embedded RAM for buffering, packet processing, or streaming data handling without immediate reliance on external memory.
• High I/O interface systems: With 520 I/O pins, the device suits designs requiring multiple parallel interfaces, front-end connectivity, or high channel counts.

Unique Advantages

• High logic density: 862,050 logic elements enable consolidation of multi-function logic into a single device, reducing system complexity.
• Significant embedded memory: Approximately 130 Mbits of on-chip RAM lowers dependence on external memory and simplifies board-level design.
• Extensive I/O count: 520 I/Os provide flexibility for interfacing, allowing designers to support numerous peripherals and signals directly.
• Compact package integration: The 1517-FCBGA (40×40) surface-mount package supports dense PCB layouts while providing robust device pinout density.
• Extended-grade operation: Rated from 0 °C to 100 °C to meet applications that require extended environmental tolerance.
• Low-voltage core operation: Core supply between 825 mV and 876 mV aligns with modern low-voltage power architectures for efficiency.

Why Choose XCVU3P-2FFVC1517E?

The XCVU3P-2FFVC1517E positions itself as a high-capacity Virtex® UltraScale+™ FPGA option for systems that require substantial programmable logic, large embedded memory, and many I/O channels within a single, compact FCBGA package. Its extended-grade temperature range and RoHS compliance make it suitable for a variety of commercial and industrial-adjacent designs.

Designed and manufactured by AMD as part of the Virtex UltraScale+ family, this device offers scalability and integration for teams building complex digital architectures that benefit from on-chip memory and high I/O density.

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